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TLC34075-135AFNR

Texas Instruments

TLC34075-135AFNR by Texas Instruments

TLC34075-135AFNR by Texas Instruments is a display controller with 1024x768 pixels. It operates b/w 0 to 70°C, with supply voltage range of 4.75V to 5.25V. This chip carrier package has 84 terminals and is suitable for commercial applications requiring palette DAC technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,715 parts In-Stock

1+ parts

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6,715

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Digiode

USA . 73 parts In-Stock

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73

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$9.668

100+ parts

-

1k+ parts

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707

$9.668

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One Stop Electronics

USA . 1,100 parts In-Stock

1+ parts

$10.000

100+ parts

-

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1,100

$10.000

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Parana Technologies

USA . 703 parts In-Stock

1+ parts

$18.586

100+ parts

-

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$18.690

10k+ parts

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703

$18.586

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$18.690

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DigiPath Technology Company

USA . 1,448 parts In-Stock

1+ parts

$20.465

100+ parts

$18.828

1k+ parts

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1,448

$20.465

$18.828

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ChromeModa Solutions

Germany . 3,322 parts In-Stock

1+ parts

$20.883

100+ parts

$17.124

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3,322

$20.883

$17.124

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$20.883

100+ parts

$19.839

1k+ parts

$18.795

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182

$20.883

$19.839

$18.795

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Corohmni

South Africa . 889 parts In-Stock

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$85.401

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889

$85.401

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Corphita

USA . 1,218 parts In-Stock

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1,218

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Overview

Elevate your display control experience with the TLC34075-135AFNR by Texas Instruments. This top-notch product boasts unrivaled quality and precision engineering, perfect for a wide range of applications in the Display Controller category. With advanced technology and a durable package body material, this chip carrier promises seamless integration and reliable performance. From its commercial-grade temperature tolerance to its palette DAC capabilities, the TLC34075-135AFNR offers unparalleled value and benefits to customers seeking superior display control solutions. Upgrade your display control systems today with Texas Instruments' finest offering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the display controller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility and compatibility with a wider range of power sources.

Address Bus Width: 4

A wider address bus width enables efficient communication and handling of data, improving overall performance.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures functionality in various environments, making it suitable for diverse applications.

Display Config: 1024 X 768 PIXELS

High resolution display configuration provides clear and sharp visuals, enhancing the viewing experience for users.

Technical Specifications

Display Controllers TLC34075-135AFNR attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TLC34075-135AFNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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