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TLC34076-110FN

Texas Instruments

TLC34076-110FN by Texas Instruments

TLC34076-110FN by Texas Instruments is a Display Controller with 8-bit External Data Bus, 4 Address Bus Width, and operates b/w 0 to 70°C. It is used for controlling displays in commercial applications requiring CMOS technology and a supply voltage range of 4.75V to 5.25V.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,924 parts In-Stock

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Digiode

USA . 4,796 parts In-Stock

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One Stop Electronics

USA . 483 parts In-Stock

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$2.000

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483

$2.000

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AZTECH Wire

Italy . 833 parts In-Stock

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$10.664

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Corohmni

South Africa . 4,961 parts In-Stock

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$39.097

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Parana Technologies

USA . 1,873 parts In-Stock

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$72.609

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ChromeModa Solutions

Germany . 6,889 parts In-Stock

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$81.583

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$66.898

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IDEA Electronic Components Group

UK . 888 parts In-Stock

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$81.583

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$77.504

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$73.425

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888

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,248 parts In-Stock

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DigiPath Technology Company

USA . 211 parts In-Stock

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$73.555

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GreenTree Electronics

Israel . 108 parts In-Stock

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Overview

Unlock the potential of your display systems with the TLC34076-110FN by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments brings you a cutting-edge Display Controller that revolutionizes how you interact with technology. Ideal for a wide range of applications, this versatile chip carrier offers unmatched performance and functionality. Experience seamless integration, enhanced visual displays, and improved efficiency with the TLC34076-110FN. Elevate your projects to the next level with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures stable and reliable performance even under varying voltage conditions.

Address Bus Width: 4

A wider address bus width allows for greater memory capacity and faster data transfer speeds.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design for space-saving installation in electronic devices.

No. of Terminals: 84

The high number of terminals enables connectivity with various external devices and components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers durability and protection for the internal components of the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures energy efficiency and prevents damage from voltage fluctuations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively even in cold environments.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized wiring connections.

Maximum Seated Height: 4.57 mm

The low maximum seated height enables the product to fit in compact electronic devices with limited space.

Width: 28 mm

The compact width of the display controller makes it suitable for installation in various electronic devices.

External Data Bus Width: 8

An external data bus width of 8 allows for high-speed data transfer and processing, enhancing overall performance.

Length: 29.3116 mm

The length of the display controller is optimized for fitting in different electronic devices without taking up too much space.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product meets industry standards and can operate effectively in typical commercial environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The product's peripheral IC type offers advanced display control and palette DAC functionality, enhancing visual output quality.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high-speed performance for the display controller.

Terminal Form: J BEND

The J bend terminal form allows for secure and reliable connections with external devices and components.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard and widely compatible with various electronic devices and power sources.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm enables compact and efficient wiring connections for the display controller.

Technical Specifications

Display Controllers TLC34076-110FN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TLC34076-110FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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