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TLC34076-135MGAB

Texas Instruments

TLC34076-135MGAB by Texas Instruments

TLC34076-135MGAB by Texas Instruments is a display controller with 8-bit external data bus width, 135 MHz clock frequency, and military temperature grade. It operates b/w -55 to 125 °C and has a package style of grid array. Ideal for applications requiring high-speed display control in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,475 parts In-Stock

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Vyrian

USA . 2,127 parts In-Stock

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Eagle Technology Solutions

USA . 72 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 322 parts In-Stock

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$7.604

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322

$7.604

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Parana Technologies

USA . 335 parts In-Stock

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$23.790

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$24.422

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335

$23.790

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$24.422

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DigiPath Technology Company

USA . 1,328 parts In-Stock

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$26.195

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$24.100

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$26.195

$24.100

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ChromeModa Solutions

Germany . 2,632 parts In-Stock

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$26.730

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$21.919

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$26.730

$21.919

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

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$26.730

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$25.394

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$24.057

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2,042

$26.730

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$24.057

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One Stop Electronics

USA . 1,092 parts In-Stock

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$30.000

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Corohmni

South Africa . 3,040 parts In-Stock

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$38.101

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Corphita

USA . 481 parts In-Stock

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Overview

Elevate your display control experience with the TLC34076-135MGAB by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers unmatched performance in the realm of Display Controllers. This innovative product offers customers unparalleled value and benefits, making it an essential component for a wide range of applications. From enhancing visual displays to streamlining data processing, the TLC34076-135MGAB is the key to unlocking endless possibilities in the world of technology. Choose Texas Instruments for reliability, efficiency, and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and reliability for the display controller, ensuring long-term performance.

Maximum Supply Voltage: 5.25 V

Allows for versatility in power supply options without exceeding the safe operating limits, providing flexibility in different system configurations.

Address Bus Width: 4

A wider address bus allows for more efficient communication between components, enhancing overall system performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board and simplifies PCB layout design.

No. of Terminals: 84

Ample number of terminals enable connectivity with multiple components, facilitating seamless integration within a system.

Package Style: GRID ARRAY

Grid array package style offers improved thermal performance and mechanical stability, enhancing overall reliability.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources, making the display controller versatile in various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the display controller suitable for demanding environments where temperature fluctuates, ensuring optimal performance under challenging conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the display controller to function reliably in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: PERPENDICULAR

Perpendicular terminal position simplifies the connection process and helps optimize signal transmission for efficient operation.

Maximum Seated Height: 5.21 mm

The low maximum seated height enables compact system designs and allows for space-efficient integration of the display controller.

Width: 32 mm

The moderate width provides a balance between compactness and ease of handling during installation and maintenance processes.

External Data Bus Width: 8

Wider external data bus width allows for faster data transfer speeds between the display controller and connected devices, enhancing overall system performance.

Maximum Clock Frequency: 135 MHz

High maximum clock frequency enables swift processing of data, ensuring smooth operation of the display controller in demanding applications.

Length: 32 mm

The moderate length of the display controller provides a good balance between performance and space-saving considerations in system design.

Temperature Grade: MILITARY

Designed to meet military-grade standards, ensuring reliable performance in harsh environmental conditions where durability and ruggedness are essential.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a palette DAC in the peripheral IC type enhances color accuracy and display quality, making this display controller suitable for graphics-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and stable performance of the display controller.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides versatility in connectivity options, allowing for easy integration with various system configurations.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation of the display controller, contributing to overall system stability.

Terminal Pitch: 2.54 mm

The standard terminal pitch simplifies installation and maintenance processes, ensuring compatibility with commonly available connectors and sockets.

Technical Specifications

Display Controllers TLC34076-135MGAB attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

135 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

TLC34076-135MGAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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