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DLP230NPAFQP

Texas Instruments

DLP230NPAFQP by Texas Instruments

DLP230NPAFQP by Texas Instruments is a display controller with 1920x1080 pixel resolution, 540 MHz clock frequency, and 65 mA supply current. It is ideal for applications requiring high-definition displays in compact spaces due to its small form factor of 16.8mm x 5.92mm x 3.823mm and low power consumption at supply voltages ranging from 1.65V to 1.95V.

Median Price

$56.280

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 843 parts In-Stock

1+ parts

$45.900

100+ parts

$40.800

1k+ parts

$30.000

10k+ parts

-

843

$45.900

$40.800

$30.000

-

Mouser Electronics

USA . 76 parts In-Stock

1+ parts

$66.660

100+ parts

$48.050

1k+ parts

-

10k+ parts

-

76

$66.660

$48.050

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 418 parts In-Stock

1+ parts

$43.605

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$43.605

-

-

-

Vyrian

USA . 7,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,071

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 674 parts In-Stock

1+ parts

$0.048

100+ parts

-

1k+ parts

-

10k+ parts

$0.046

674

$0.048

-

-

$0.046

Parana Technologies

USA . 971 parts In-Stock

1+ parts

$3.233

100+ parts

-

1k+ parts

$3.756

10k+ parts

-

971

$3.233

-

$3.756

-

ChromeModa Solutions

Germany . 4,031 parts In-Stock

1+ parts

$3.633

100+ parts

$2.979

1k+ parts

-

10k+ parts

-

4,031

$3.633

$2.979

-

-

IDEA Electronic Components Group

UK . 305 parts In-Stock

1+ parts

$3.633

100+ parts

-

1k+ parts

$3.270

10k+ parts

-

305

$3.633

-

$3.270

-

Corphita

USA . 863 parts In-Stock

1+ parts

$41.310

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$41.310

-

-

-

Microchip USA

USA . 2,039 parts In-Stock

1+ parts

$155.790

100+ parts

$153.080

1k+ parts

$151.720

10k+ parts

$150.370

2,039

$155.790

$153.080

$151.720

$150.370

Northwest PG Solutions

USA . 2,325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,325

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

-

100+ parts

$3.276

1k+ parts

-

10k+ parts

-

340

-

$3.276

-

-

Overview

Elevate your display experience with the DLP230NPAFQP by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the Display Controllers category. This versatile product boasts a wide range of applications, offering customers seamless integration and exceptional performance. With advanced features and a sleek design, the DLP230NPAFQP provides unmatched value, benefits, and advantages to enhance your visual projects. Upgrade your display solutions today and see the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability, making the product suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.95 V

With a high maximum supply voltage, the product can handle power fluctuations without risk of damage, ensuring stability and longevity.

Package Shape: RECTANGULAR

The rectangular package shape is standard and fits well within typical circuit board layouts, enhancing compatibility and ease of use.

No. of Terminals: 54

Having a high number of terminals allows for complex connectivity and functionality, enabling the product to support a wide range of features and interfaces.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and signal transmission, contributing to overall performance and reliability.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage ensures energy efficiency and compatibility with a variety of power sources, making the product versatile and cost-effective.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to withstand heat and perform reliably in demanding conditions, increasing its usability and durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments, making the product suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and maintenance, simplifying the overall design and setup process for users.

Display Config: 1920 X 1080 PIXELS

The high-resolution display configuration delivers crisp and clear visuals, enhancing the user experience and making the product ideal for high-definition applications.

Maximum Seated Height: 3.823 mm

The low maximum seated height helps minimize the overall height profile of the product, allowing for sleek and compact designs in various devices.

Width: 5.92 mm

The slim width of the product enables space-saving integration into compact electronic devices, providing flexibility in design and layout.

Maximum Clock Frequency: 540 MHz

The high maximum clock frequency supports rapid data processing and transmission, enhancing the product's overall performance and responsiveness.

Length: 16.8 mm

The moderate length of the product offers a balance between functionality and compactness, making it suitable for various form factors and applications.

Peripheral IC Type: DISPLAY CONTROLLER, DLP

Being a display controller with DLP technology, the product ensures efficient and high-quality image processing, making it a reliable choice for display applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration capability, making the product energy-efficient and versatile in a variety of applications.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers better reliability and conductivity, ensuring a longer lifespan for the product.

Maximum Supply Current: 65 mA

With a moderate maximum supply current, the product operates efficiently without excessive power consumption, contributing to energy savings and prolonged battery life.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable operating condition for the product, ensuring consistent performance and reliable functionality over time.

Bus Compatibility: I2C, SPI

Support for I2C and SPI bus compatibility allows for flexible communication and control options, enabling seamless integration with various systems and devices.

Technical Specifications

Display Controllers DLP230NPAFQP attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Bus Compatibility:

I2C, SPI

Maximum Clock Frequency:

540 MHz

Display Config:

1920 X 1080 PIXELS

JESD-30 Code:

R-CBGA-N54

Length:

16.8 mm

No. of Terminals:

54

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.823 mm

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Width:

5.92 mm

Peripheral IC Type:

Trade Compliance

DLP230NPAFQP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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