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TVP3026-135BMDN

Texas Instruments

TVP3026-135BMDN by Texas Instruments

TVP3026-135BMDN by Texas Instruments is a Display Controller with 1280x1024 pixels. It operates at 4.75-5.25V, -40 to 70°C, and has an 8-bit external data bus width. Ideal for commercial applications requiring high-resolution display control in a compact flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,897 parts In-Stock

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4,897

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Vyrian

USA . 4,390 parts In-Stock

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4,390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 315 parts In-Stock

1+ parts

$13.000

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315

$13.000

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AZTECH Wire

Italy . 694 parts In-Stock

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$18.210

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694

$18.210

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Corohmni

South Africa . 4,969 parts In-Stock

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$30.111

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$30.111

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Parana Technologies

USA . 1,960 parts In-Stock

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$66.324

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1,960

$66.324

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ChromeModa Solutions

Germany . 4,633 parts In-Stock

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$74.521

100+ parts

$61.107

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4,633

$74.521

$61.107

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$74.521

100+ parts

$70.795

1k+ parts

$67.069

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2,100

$74.521

$70.795

$67.069

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Corphita

USA . 2,281 parts In-Stock

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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$67.188

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1,124

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$67.188

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Overview

Elevate your display experience with the TVP3026-135BMDN by Texas Instruments. Known for its superior quality and reliability, Texas Instruments delivers cutting-edge technology in display controllers. Whether you're designing a high-resolution monitor or a digital signage system, this product offers exceptional value and performance. With a wide range of applications and advanced features, the TVP3026-135BMDN is the perfect choice for your next project. Upgrade your display solutions with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and stability, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and secure attachment to circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides margin for fluctuations in power supply, enhancing reliability.

Address Bus Width: 4

Wide address bus width enables efficient communication and data transfer between components for optimal performance.

Package Shape: SQUARE

Square package shape facilitates uniformity in design layout and integration within electronic systems.

No. of Terminals: 160

Abundance of terminals allows for multiple connections and interactions with other devices, enhancing versatility and functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers compact size and efficient heat dissipation, ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage requirement ensures compatibility with a wide range of power sources, increasing flexibility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature threshold enables reliable performance in harsh environmental conditions or prolonged usage.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality across various temperature ranges, enhancing product reliability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and signals, contributing to organized circuit layouts.

Display Config: 1280 X 1024 PIXELS

High-resolution display configuration provides crisp and detailed visual output, enhancing user experience and readability.

Maximum Seated Height: 4.07 mm

Low maximum seated height enables slim and compact design integration, suitable for space-saving applications.

Width: 27.64 mm

Optimal width dimension offers balance between space efficiency and component stability, suitable for various design layouts.

External Data Bus Width: 8

Wide external data bus width allows for fast and efficient data transmission, optimizing display performance and responsiveness.

Length: 27.64 mm

Symmetrical length dimension complements the square package shape, facilitating uniformity in design and layout.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making the product suitable for a wide range of applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Inclusion of display controller and palette DAC peripheral IC types enhances display customization and control options, expanding the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient operation and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure solder connections, ensuring durability and reliability in operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation of the product within specified voltage ranges.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense packing and efficient use of board space, making the product suitable for compact designs.

Technical Specifications

Display Controllers TVP3026-135BMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-135BMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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