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TVP3025-200MDN

Texas Instruments

TVP3025-200MDN by Texas Instruments

TVP3025-200MDN by Texas Instruments is a display controller with 1600x1280 pixels, CMOS technology, and 8-bit external data bus width. It operates b/w 0-70°C, has a package style of flatpack, and supports a max supply voltage of 5.25V. Ideal for commercial applications requiring high-resolution displays in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,142 parts In-Stock

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5,142

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Digiode

USA . 1,016 parts In-Stock

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1,016

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 485 parts In-Stock

1+ parts

$15.895

100+ parts

-

1k+ parts

$16.251

10k+ parts

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485

$15.895

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$16.251

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DigiPath Technology Company

USA . 237 parts In-Stock

1+ parts

$17.503

100+ parts

$16.103

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237

$17.503

$16.103

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IDEA Electronic Components Group

UK . 2,111 parts In-Stock

1+ parts

$17.860

100+ parts

$16.967

1k+ parts

$16.074

10k+ parts

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2,111

$17.860

$16.967

$16.074

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ChromeModa Solutions

Germany . 100 parts In-Stock

1+ parts

$17.860

100+ parts

$14.645

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100

$17.860

$14.645

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AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$18.482

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720

$18.482

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One Stop Electronics

USA . 1,147 parts In-Stock

1+ parts

$28.000

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1,147

$28.000

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Corohmni

South Africa . 2,944 parts In-Stock

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$59.795

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2,944

$59.795

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Corphita

USA . 999 parts In-Stock

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999

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Overview

Elevate your display experience with the TVP3025-200MDN by Texas Instruments. Crafted with precision and quality, this display controller offers unparalleled performance and reliability. Ideal for a wide range of applications, this product brings exceptional value to customers seeking seamless integration and enhanced visual output. Trust in Texas Instruments' legacy of excellence and innovation, and unlock the full potential of your display systems with the TVP3025-200MDN.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides flexibility and reliability in power input, reducing the risk of voltage-related issues.

Address Bus Width: 5

Wider address bus width allows for efficient and fast data communication, improving overall performance and responsiveness of the display controller.

Package Shape: SQUARE

Square package shape facilitates easy mounting and alignment on PCBs, optimizing space usage and ensuring a clean layout.

No. of Terminals: 160

Greater number of terminals allow for more connections and functionalities, enhancing the versatility and compatibility of the display controller.

Package Style (Meter): FLATPACK

Flatpack package style offers a low-profile design, ideal for space-constrained applications and enabling sleek and compact product designs.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage requirement ensures compatibility with a wide range of power sources, increasing the product's flexibility and usability.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows for reliable performance in various environmental conditions, increasing the product's durability and lifespan.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in cold environments, making the display controller suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position facilitates easy connections and soldering processes, improving the efficiency and accuracy of assembly and maintenance tasks.

Display Config: 1600 X 1280 PIXELS

High display resolution of 1600 x 1280 pixels ensures clear and detailed visuals, making the display controller suitable for high-quality display applications.

Maximum Seated Height: 4.07 mm

Low maximum seated height enables a slim profile for the overall product design, ideal for compact and sleek electronic devices.

Width: 27.64 mm

Optimal width dimension allows for easy integration and alignment within electronic systems, ensuring a neat and organized layout.

External Data Bus Width: 8

Wider external data bus width enhances data transfer speed and efficiency, enabling smooth and responsive display performance.

Length: 27.64 mm

Balanced length dimension ensures compatibility with standard PCB sizes and facilitates easy placement within electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade rating indicates suitability for typical commercial operating environments, ensuring reliable performance in everyday use.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Inclusion of display controller and palette DAC peripherals enhances the functionality and versatility of the product, providing advanced display management capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, resulting in efficient operation and optimized performance of the display controller.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process and ensures secure connections, enhancing the reliability and durability of the display controller.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable power input, contributing to the overall stability and performance of the display controller.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables compact design and efficient PCB layout, facilitating high-density integration of the display controller in electronic devices.

Technical Specifications

Display Controllers TVP3025-200MDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

5

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3025-200MDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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