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IMSG174JI66Z

STMicroelectronics

IMSG174JI66Z by STMicroelectronics

IMSG174JI66Z by STMicroelectronics is a Display Controller with 1024x768 pixels, MOS technology, and 8-bit external data bus width. It operates b/w 0-70 °C, has a supply voltage range of 4.75-5.25V, and is used in commercial applications for display control with palette DAC functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,670

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-

-

-

Vyrian

USA . 1,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,709

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-

-

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Anansix

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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140

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$59.070

100+ parts

-

1k+ parts

$53.163

10k+ parts

-

1,411

$59.070

-

$53.163

-

Corohmni

South Africa . 489 parts In-Stock

1+ parts

$84.784

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$84.784

-

-

-

MKK Technologies

India . 687 parts In-Stock

1+ parts

$111.078

100+ parts

-

1k+ parts

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10k+ parts

-

687

$111.078

-

-

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DigiPath Technology Company

USA . 687 parts In-Stock

1+ parts

$111.078

100+ parts

-

1k+ parts

-

10k+ parts

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687

$111.078

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-

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Corphita

USA . 2,368 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,368

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Parana Technologies

USA . 594 parts In-Stock

1+ parts

-

100+ parts

$70.628

1k+ parts

-

10k+ parts

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594

-

$70.628

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-

Overview

Elevate your display experience with the IMSG174JI66Z by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge Display Controllers that excel in a variety of applications. This chip carrier package offers customers unparalleled value and benefits, boasting a wide range of features such as a high-resolution display configuration, commercial-grade temperature tolerance, and low power consumption. Upgrade your visual displays with the IMSG174JI66Z and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on the circuit board.

Maximum Supply Voltage: 5.25 V

The higher supply voltage allows for efficient operation and performance of the display controller.

Address Bus Width: 4

A wider address bus allows for faster data transfer and processing, enhancing the overall performance of the product.

Package Shape: SQUARE

The square shape of the package ensures easy mounting and compatibility with standard board layouts.

No. of Terminals: 44

The higher number of terminals enables more connections and functionalities, making the product versatile and capable of handling various tasks.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides compactness and efficient heat dissipation, ensuring optimal performance of the display controller.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures stable operation and reliability of the product, even under fluctuating power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and conductivity, ensuring secure connections and efficient operation of the display controller.

Display Config: 1024 X 768 PIXELS

The high resolution display configuration ensures crisp and clear images, making the product ideal for applications requiring detailed visuals.

Maximum Seated Height: 4.572 mm

The low maximum seated height allows for slim and compact designs, making the product suitable for space-constrained applications.

Width: 16.637 mm

The compact width of the product enables easy integration into various systems without occupying too much space.

External Data Bus Width: 8

An 8-bit external data bus width allows for fast data transfer and processing, enhancing the efficiency and speed of the display controller.

Length: 16.637 mm

The compact length of the product ensures easy installation and compatibility with standard board layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in typical operating conditions, making the product reliable for commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC allows for advanced display control and color management, enhancing the visual quality of the product.

Technology: MOS

MOS technology offers high efficiency and speed, enabling the display controller to deliver optimal performance in various applications.

Terminal Form: J BEND

The J bend terminal form provides secure connections and ease of soldering, ensuring reliable operation of the display controller.

Maximum Supply Current: 250 mA

The maximum supply current of 250 mA allows for efficient power consumption and operation, making the product energy-efficient.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures stable and reliable operation of the display controller, meeting standard power requirements.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for compact design and easy connections, making the product suitable for space-constrained applications.

Technical Specifications

Display Controllers IMSG174JI66Z attributes and parameters. Explore more Display Controllers devices from STMicroelectronics

Specs

Address Bus Width:

4

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.637 mm

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.637 mm

Peripheral IC Type:

Trade Compliance

IMSG174JI66Z Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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