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IMSG176J-80SF

STMicroelectronics

IMSG176J-80SF by STMicroelectronics

IMSG176J-80SF by STMicroelectronics is a Display Controller with 1024x768 pixels, CMOS technology, and IBM PS/2 bus compatibility. It operates b/w 0 to 70 °C, has a supply voltage range of 4.75V to 5.25V, and consumes up to 210mA. Ideal for commercial applications requiring high-resolution display control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,371 parts In-Stock

1+ parts

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2,371

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Digiode

USA . 1,693 parts In-Stock

1+ parts

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1k+ parts

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1,693

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Anansix

USA . 466 parts In-Stock

1+ parts

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100+ parts

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466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$40.659

100+ parts

-

1k+ parts

$36.593

10k+ parts

-

1,524

$40.659

-

$36.593

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Corohmni

South Africa . 3,177 parts In-Stock

1+ parts

$44.437

100+ parts

-

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10k+ parts

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3,177

$44.437

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MKK Technologies

India . 1,343 parts In-Stock

1+ parts

$76.457

100+ parts

-

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10k+ parts

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1,343

$76.457

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DigiPath Technology Company

USA . 1,343 parts In-Stock

1+ parts

$76.457

100+ parts

-

1k+ parts

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10k+ parts

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1,343

$76.457

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Corphita

USA . 2,154 parts In-Stock

1+ parts

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2,154

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Parana Technologies

USA . 451 parts In-Stock

1+ parts

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100+ parts

$48.614

1k+ parts

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451

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$48.614

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Overview

Discover the cutting-edge IMSG176J-80SF display controller by STMicroelectronics, a trusted manufacturer known for delivering top-quality products. Ideal for various applications, this chip carrier package offers exceptional value with its versatile features and high performance. With a wide temperature range and compatibility with IBM PS/2 bus, this display controller provides seamless integration and optimal functionality. Elevate your projects with the IMSG176J-80SF's advanced technology and reliable performance, setting new standards in display control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and less prone to damage during handling.

Surface Mount: YES

Surface mount technology allows for easy installation and removal of the display controller on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility and compatibility with a wide range of power sources, ensuring that the display controller operates reliably under varying conditions.

Address Bus Width: 2

A wider address bus width allows for efficient data transfer and communication within the device, enhancing overall performance and speed of the display controller.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration into existing circuit designs and layouts, saving space and improving overall aesthetics of the product.

No. of Terminals: 32

Having 32 terminals provides a sufficient number of connection points for interfacing with other components, ensuring seamless integration and functionality of the display controller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and efficient, allowing for a smaller footprint on the circuit board, enabling space-saving design and layout options.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage ensures energy efficiency and compatibility with a variety of power sources, making the display controller more versatile in different operating environments.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the display controller can withstand extended use in various conditions without overheating, ensuring long-term reliability and durability.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature allows the display controller to function in cold environments without performance degradation, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance of the display controller in electronic devices.

Terminal Position: QUAD

Quad terminal position offers convenient accessibility and organization of connections, simplifying installation and maintenance of the display controller in circuit board assemblies.

Display Config: 1024 X 768 PIXELS

With a high display configuration of 1024 x 768 pixels, the display controller supports high-resolution visuals and crisp images, enhancing overall display quality and user experience.

Maximum Seated Height: 3.556 mm

A low maximum seated height enables compact and slim design options for electronic devices housing the display controller, making it ideal for space-constrained applications.

Width: 11.557 mm

Narrow width dimensions allow for flexibility in placement and integration of the display controller in different electronic devices, contributing to versatile design possibilities.

External Data Bus Width: 8

An external data bus width of 8 bits facilitates faster data transfer and processing, leading to improved efficiency and performance of the display controller in handling multimedia content.

Length: 14.097 mm

Compact length dimensions provide space-saving options for integrating the display controller into electronic devices, enabling sleek and efficient design layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation of the display controller in standard environmental conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC in the peripheral IC type enhances color control and image rendering capabilities of the display controller, resulting in vivid and accurate display output.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, leading to energy-efficient and compact design of the display controller with reliable performance.

Terminal Form: J BEND

J bend terminal form provides secure connections and easy soldering options for the display controller, ensuring stable electrical connections and hassle-free installation.

Maximum Supply Current: 210 mA

A maximum supply current of 210 mA indicates efficient power consumption and minimal heat generation, ensuring reliable operation and longevity of the display controller in electronic devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a common and widely compatible power requirement, allowing the display controller to be easily integrated into various electronic systems and applications.

Bus Compatibility: IBM PS/2

IBM PS/2 bus compatibility ensures seamless integration and communication with IBM-compatible systems, expanding the interoperability and versatility of the display controller in different computing environments.

Terminal Pitch: 1.27 mm

A compact terminal pitch of 1.27 mm enables efficient routing of connections and space-saving design options for the display controller on circuit boards, optimizing layout and assembly considerations.

Technical Specifications

Display Controllers IMSG176J-80SF attributes and parameters. Explore more Display Controllers devices from STMicroelectronics

Specs

Address Bus Width:

2

Bus Compatibility:

IBM PS/2

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

14.097 mm

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.556 mm

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.557 mm

Peripheral IC Type:

Trade Compliance

IMSG176J-80SF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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