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LC74784M

Onsemi

LC74784M by Onsemi

LC74784M by Onsemi is a display controller with 24 terminals, operating at temperatures from -30 °C to 70°C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,465 parts In-Stock

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Vyrian

USA . 60 parts In-Stock

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60

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TANS Electronics

Latvia . 8,315 parts In-Stock

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8,315

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SupplyDigital Components

Austria . 5,829 parts In-Stock

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Corphita

USA . 2,192 parts In-Stock

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Kulean Microsystems

USA . 2,002 parts In-Stock

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UHIMA Technologies

Türkiye . 565 parts In-Stock

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565

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Problanco Electronics

Mexico . 477 parts In-Stock

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Corohmni

South Africa . 196 parts In-Stock

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Overview

Unlock the next level of display control with the LC74784M by Onsemi. Crafted with precision and expertise, this small outline graphics processor offers unparalleled quality and reliability. Seamlessly integrating into various applications, this display controller provides a seamless user experience with its advanced technology and innovative design. Elevate your projects with the value and benefits that only Onsemi can deliver. Trust in the LC74784M to exceed your expectations and bring your vision to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package lightweight and durable, ideal for portable or handheld devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product on circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily accommodated on circuit boards.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources and reduces the need for additional voltage regulation.

No. of Terminals: 24

Having 24 terminals provides flexibility in connection options and allows for multiple input/output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and enables compact design.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, the product can withstand cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position allows for better signal transmission and reduces the risk of signal interference.

Peripheral IC Type: GRAPHICS PROCESSOR

Having a graphics processor as a peripheral IC type enhances the display capabilities and performance of the product.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and efficient contact with the circuit board.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures consistent and reliable power delivery.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product allows for precise and reliable connections on the circuit board.

Technical Specifications

Display Controllers LC74784M attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74784M Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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