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TVP3026-175MHFG

Texas Instruments

TVP3026-175MHFG by Texas Instruments

TVP3026-175MHFG by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 14.31818 MHz clock frequency. Ideal for military applications due to its MIL temperature grade and ceramic-metal package body material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,686 parts In-Stock

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7,686

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Digiode

USA . 4,051 parts In-Stock

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4,051

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Distributors (Availability)

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One Stop Electronics

USA . 306 parts In-Stock

1+ parts

$15.000

100+ parts

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306

$15.000

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AZTECH Wire

Italy . 270 parts In-Stock

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$16.904

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270

$16.904

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Parana Technologies

USA . 673 parts In-Stock

1+ parts

$22.847

100+ parts

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$23.506

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673

$22.847

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$23.506

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ChromeModa Solutions

Germany . 6,750 parts In-Stock

1+ parts

$25.671

100+ parts

$21.050

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6,750

$25.671

$21.050

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IDEA Electronic Components Group

UK . 799 parts In-Stock

1+ parts

$25.671

100+ parts

$24.387

1k+ parts

$23.104

10k+ parts

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799

$25.671

$24.387

$23.104

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Corphita

USA . 4,486 parts In-Stock

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4,486

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DigiPath Technology Company

USA . 883 parts In-Stock

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$23.145

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883

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$23.145

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Overview

Enhance your display with the TVP3026-175MHFG by Texas Instruments, a top-tier manufacturer known for quality and innovation. This display controller offers unparalleled performance and reliability, making it ideal for a wide range of applications. Its advanced technology ensures crisp, vibrant images at a fraction of the cost, providing exceptional value to customers. Upgrade your display system today with the TVP3026-175MHFG and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability for the product.

Surface Mount: YES

Being surface mountable, it allows for easy installation and reduces overall space requirements in a design.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage tolerance, this display controller can handle power fluctuations without risking damage.

Address Bus Width: 4

The address bus width of 4 enhances the data processing speed and efficiency of the display controller.

Package Shape: SQUARE

The square package shape offers a compact form factor and efficient layout for integration into various devices.

No. of Terminals: 164

The high number of terminals allows for more connectivity options, enabling versatile usage scenarios.

Package Style (Meter): FLATPACK

The flatpack package style simplifies handling and provides a stable mounting solution for the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures a wide operating range and compatibility with various power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in extreme cold environments without performance degradation.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and secure attachment of external components to the display controller.

Display Config: 1600 X 1280 PIXELS

The high-resolution display configuration offers crisp and detailed visuals for an enhanced viewing experience.

Maximum Seated Height: 4.01 mm

The low maximum seated height enables a slim design profile and easy integration into compact devices.

Width: 25.4 mm

The moderate width provides a balance between space efficiency and accessibility for the display controller.

External Data Bus Width: 8

With an external data bus width of 8, the display controller can process and transfer data efficiently for smooth operation.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency allows for fast data processing and response times, ideal for demanding applications.

Length: 25.4 mm

The length of 25.4 mm complements the width and seated height for a well-proportioned design of the display controller.

Temperature Grade: MILITARY

Designed for military-grade applications, this display controller offers ruggedness and reliability in harsh conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC enhances the overall functionality and performance of the product.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with various systems.

Terminal Form: FLAT

The flat terminal form factor simplifies installation and maintenance of the display controller in electronic devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides stable and consistent power delivery for optimal performance.

Terminal Pitch: 0.635 mm

The tight terminal pitch of 0.635 mm allows for high-density mounting, saving space and enabling compact designs.

Technical Specifications

Display Controllers TVP3026-175MHFG attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CQFP-F164

Length:

25.4 mm

No. of Terminals:

164

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.01 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25.4 mm

Peripheral IC Type:

Trade Compliance

TVP3026-175MHFG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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