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LC74788

Onsemi

LC74788 by Onsemi

LC74788 by Onsemi is a display controller with 24 terminals, operating at 5V. It features a CMOS technology graphics processor and operates b/w -30 °C to 70°C. This rectangular package is ideal for applications requiring high-quality image processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,437 parts In-Stock

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2,437

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Digiode

USA . 1,594 parts In-Stock

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1,594

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Distributors (Availability)

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SupplyDigital Components

Austria . 8,109 parts In-Stock

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8,109

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Problanco Electronics

Mexico . 7,480 parts In-Stock

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7,480

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TANS Electronics

Latvia . 5,136 parts In-Stock

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5,136

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Corphita

USA . 2,104 parts In-Stock

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2,104

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Kulean Microsystems

USA . 1,474 parts In-Stock

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1,474

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UHIMA Technologies

Türkiye . 650 parts In-Stock

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650

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Corohmni

South Africa . 403 parts In-Stock

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403

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Overview

Enhance your display experience with the LC74788 from Onsemi, a top-tier manufacturer known for quality and reliability. As a leading player in the display controllers category, this product offers unrivaled performance and versatility for a wide range of applications. With its advanced technology and innovative design, the LC74788 delivers exceptional value, benefits, and advantages to customers looking to elevate their visual solutions. Say goodbye to mediocre displays and hello to superior quality with the LC74788.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material offers good durability and protection for the display controller, making it suitable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape is commonly used for easy integration and installation in various electronic devices.

Power Supplies (V): 5

Operating at a power supply of 5V ensures compatibility with standard power sources, making it convenient for users.

No. of Terminals: 24

Having 24 terminals provides a wide range of connectivity options for various peripherals, allowing for versatile use.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line and shrink pitch package style offers a compact design, saving space in electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the display controller can function effectively even in high-temperature environments.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30 °C ensures the display controller can withstand cold temperatures, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and reliability, ensuring that the display controller can handle multiple input/output signals efficiently.

Peripheral IC Type: GRAPHICS PROCESSOR

Featuring a graphics processor as the peripheral IC type enables high-quality image processing and display capabilities, making it ideal for applications requiring advanced graphics rendering.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the display controller.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides a strong and reliable connection, ensuring stable performance and durability of the display controller.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures consistent and stable performance, making the display controller reliable for various applications.

Terminal Pitch: 1.78 mm

With a terminal pitch of 1.78mm, the display controller offers precise and reliable connections, enhancing its compatibility with different electronic devices.

Technical Specifications

Display Controllers LC74788 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74788 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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