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TVP3026-220BMDN

Texas Instruments

TVP3026-220BMDN by Texas Instruments

TVP3026-220BMDN by Texas Instruments is a Display Controller with 1280x1024 pixels, 8-bit data bus, and 14.31818 MHz clock frequency. It is used in commercial applications for driving displays with a resolution of up to 1280x1024 pixels efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,301 parts In-Stock

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4,301

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Vyrian

USA . 3,334 parts In-Stock

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3,334

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,093 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,093

$5.000

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$10.779

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347

$10.779

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Parana Technologies

USA . 92 parts In-Stock

1+ parts

$38.768

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92

$38.768

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$42.689

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752

$42.689

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ChromeModa Solutions

Germany . 5,708 parts In-Stock

1+ parts

$43.560

100+ parts

$35.719

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5,708

$43.560

$35.719

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IDEA Electronic Components Group

UK . 864 parts In-Stock

1+ parts

$43.560

100+ parts

$41.382

1k+ parts

$39.204

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864

$43.560

$41.382

$39.204

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Corohmni

South Africa . 410 parts In-Stock

1+ parts

$63.677

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410

$63.677

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Corphita

USA . 1,580 parts In-Stock

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1,580

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Overview

Elevate your display experience with the TVP3026-220BMDN from Texas Instruments. Crafted with precision and expertise, this display controller delivers unparalleled quality and performance. Whether you're in need of crystal-clear graphics for your digital signage, gaming console, or medical imaging equipment, this product has got you covered. With a sleek metal package body and a wide range of operating temperatures, the TVP3026-220BMDN offers reliability and durability like no other. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: METAL

Using metal as the package body material provides better durability and heat dissipation, making the product more reliable for long-term use.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for more flexibility in powering the display controller, accommodating a wider range of power sources.

Address Bus Width: 4

With a wider address bus width, the display controller can handle larger amounts of data more efficiently, resulting in faster processing and smoother visuals on the display.

Display Config: 1280 X 1024 PIXELS

The high resolution display configuration of 1280 x 1024 pixels ensures crisp and clear images on the screen, making it ideal for applications where image quality is crucial.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency allows for fast data processing and refresh rates on the display, delivering smooth and responsive visual output.

Technical Specifications

Display Controllers TVP3026-220BMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-220BMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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