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TVP3026-135-MAHFG

Texas Instruments

TVP3026-135-MAHFG by Texas Instruments

TVP3026-135-MAHFG by Texas Instruments is a display controller with 1280x1024 pixels, 8-bit data bus, and 14.31818 MHz clock frequency. Ideal for military applications due to its MIL grade temperature range of -55°C to 125°C and ceramic-metal sealed co-fired package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,623 parts In-Stock

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Digiode

USA . 292 parts In-Stock

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AZTECH Wire

Italy . 817 parts In-Stock

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$11.455

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One Stop Electronics

USA . 1,462 parts In-Stock

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$32.000

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Parana Technologies

USA . 1,118 parts In-Stock

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$46.974

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DigiPath Technology Company

USA . 595 parts In-Stock

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$51.724

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$47.586

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595

$51.724

$47.586

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ChromeModa Solutions

Germany . 6,363 parts In-Stock

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$52.780

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$43.280

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$52.780

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$50.141

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$47.502

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$47.502

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Corohmni

South Africa . 468 parts In-Stock

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$79.699

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Corphita

USA . 1,815 parts In-Stock

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Overview

Enhance your display control with the TVP3026-135-MAHFG by Texas Instruments, a top-notch manufacturer known for quality and reliability. This display controller is perfect for applications requiring high-resolution graphics, offering seamless performance and easy integration. With a wide temperature range and military-grade durability, this product ensures longevity and efficiency in various settings. Upgrade your display systems with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability of the product, making it suitable for rugged environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage provides operational flexibility and margin for power variations, enhancing the product's stability.

Address Bus Width: 4

The 4-bit address bus width allows for efficient communication and control of memory addresses, contributing to faster data processing.

Package Shape: SQUARE

The square package shape enables compact and space-saving design layouts, ideal for applications with limited space constraints.

No. of Terminals: 164

Having a higher number of terminals allows for more connections and functions, making the product versatile and suitable for complex display configurations.

Package Style (Meter): FLATPACK, GUARD RING

The flatpack style with a guard ring provides enhanced protection against electromagnetic interference, ensuring signal integrity and reliability.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage specification ensures compatibility with a wide range of power sources, making the product more versatile and adaptable.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme environmental conditions, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature capability allows the product to function effectively in cold climates or refrigerated environments.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and integration into circuit layouts, simplifying installation and maintenance processes.

Display Config: 1280 X 1024 PIXELS

The high-resolution display configuration of 1280 x 1024 pixels provides sharp and detailed visual output, ideal for demanding graphic applications.

Maximum Seated Height: 3.3 mm

The low maximum seated height allows for slim and compact device designs, making the product suitable for space-constrained applications.

Width: 28.705 mm

The compact width dimension enables easy integration and placement of the product in various electronic devices, enhancing design flexibility.

External Data Bus Width: 8

With an external data bus width of 8 bits, the product can handle large amounts of data efficiently, supporting high-speed data processing.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency allows for rapid data transfer and processing speeds, making the product suitable for high-performance applications.

Length: 28.705 mm

The moderate length dimension offers a balanced form factor, facilitating easy installation and compatibility with standard mounting configurations.

Temperature Grade: MILITARY

The military-grade temperature specification ensures reliability and performance in harsh operating conditions, making the product suitable for critical military applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of display controller and palette DAC peripherals enhances the product's versatility and functionality, enabling precise control and customization of visual output.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and efficiency.

Terminal Form: FLAT

The flat terminal form factor simplifies connection and soldering processes, ensuring reliable and secure electrical connections for optimal performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides stable and consistent power delivery, ensuring reliable operation and compatibility with standard power sources.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm allows for high-density mounting and compact PCB designs, enabling efficient use of space and facilitating miniaturization.

Technical Specifications

Display Controllers TVP3026-135-MAHFG attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CQFP-F164

Length:

28.705 mm

No. of Terminals:

164

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Qualification:

Not Qualified

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

28.705 mm

Peripheral IC Type:

Trade Compliance

TVP3026-135-MAHFG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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