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TMS9918AJDH

Texas Instruments

TMS9918AJDH by Texas Instruments

TMS9918AJDH by Texas Instruments is a MOS display controller with 40 terminals in an inline rectangular ceramic package. It operates b/w 0-55°C, suitable for commercial applications. With a terminal pitch of 2.54mm, it's ideal for graphics and video display systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,915 parts In-Stock

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6,915

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Digiode

USA . 4,465 parts In-Stock

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4,465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 83 parts In-Stock

1+ parts

$17.457

100+ parts

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83

$17.457

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One Stop Electronics

USA . 1,357 parts In-Stock

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$19.000

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1,357

$19.000

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AZTECH Wire

Italy . 428 parts In-Stock

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$19.166

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428

$19.166

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Parana Technologies

USA . 1,455 parts In-Stock

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$52.660

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1,455

$52.660

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DigiPath Technology Company

USA . 1,387 parts In-Stock

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$57.986

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1,387

$57.986

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ChromeModa Solutions

Germany . 3,279 parts In-Stock

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$59.169

100+ parts

$48.519

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3,279

$59.169

$48.519

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

1+ parts

$59.169

100+ parts

$56.211

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$53.252

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1,149

$59.169

$56.211

$53.252

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Corphita

USA . 894 parts In-Stock

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894

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Overview

Discover the unmatched quality and reliability of the TMS9918AJDH by Texas Instruments, a leading manufacturer in display controllers. This cutting-edge product offers seamless integration and exceptional performance in a wide range of applications. Experience the value and benefits of this device, from its durable ceramic package to its temperature grade designed for commercial use. Elevate your projects with the TMS9918AJDH and unlock endless possibilities in display control technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable material that provides excellent heat dissipation, making the display controller suitable for high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic devices.

No. of Terminals: 40

Having a high number of terminals allows for more connectivity options and flexibility in interfacing with other components.

Package Style (Meter): IN-LINE

In-line package style is compact and space-saving, ideal for applications where space is limited.

Maximum Operating Temperature: 55 °C

With a high maximum operating temperature, the display controller can withstand extended use without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures operation in a wide range of environments, including cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard commercial environments.

Technology: MOS

MOS technology offers low power consumption and high speed performance, making the display controller energy efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections on the circuit board.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm is widely used and allows for compatibility with other components and PCB designs.

Technical Specifications

Display Controllers TMS9918AJDH attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS9918AJDH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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