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TMS9929ANL

Texas Instruments

TMS9929ANL by Texas Instruments

TMS9929ANL by Texas Instruments is a Display Controller with 40 terminals in PLASTIC/EPOXY package. It operates b/w 0-70°C, suitable for commercial applications. Utilizes MOS technology with 2.54mm terminal pitch for through-hole mounting in rectangular IN-LINE style package.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 5,776 parts In-Stock

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Digiode

USA . 2,599 parts In-Stock

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Cyclops Electronics Ltd

UK . 155 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 117 parts In-Stock

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Holdelec - ElecDif-Pro

France . 117 parts In-Stock

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Inland Empire Components Inc.

USA . 48 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 4 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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AZTECH Wire

Italy . 725 parts In-Stock

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$6.682

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Parana Technologies

USA . 972 parts In-Stock

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$16.365

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$16.663

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DigiPath Technology Company

USA . 2,107 parts In-Stock

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$18.020

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ChromeModa Solutions

Germany . 3,743 parts In-Stock

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$18.388

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$15.078

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IDEA Electronic Components Group

UK . 432 parts In-Stock

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$17.469

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$16.549

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One Stop Electronics

USA . 1,330 parts In-Stock

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$23.000

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Corohmni

South Africa . 3,161 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,111 parts In-Stock

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Corphita

USA . 2,330 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Upgrade your display experience with the TMS9929ANL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is known for its high-quality products and innovative solutions. The TMS9929ANL falls under the category of Display Controllers, offering reliable performance and seamless integration. Whether you're looking to enhance your gaming console, digital signage, or industrial display, this product delivers exceptional value and versatility. Trust in Texas Instruments to elevate your visual experience and unlock new possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the display controller easy to handle and resistant to damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization and easy integration into various electronic devices.

No. of Terminals: 40

Having a higher number of terminals provides more connectivity options and flexibility in the device's functionality.

Package Style (Meter): IN-LINE

The in-line package style is compact and space-saving, making it suitable for applications where space is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates reliable performance in typical commercial applications.

Technology: MOS

MOS technology offers high-speed performance and low power consumption, making the display controller energy-efficient.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a stable connection and ease of soldering during assembly.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch allows for easy interfacing with other electronic components and PCBs.

Technical Specifications

Display Controllers TMS9929ANL attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS9929ANL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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