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STG1702

STMicroelectronics

STG1702 by STMicroelectronics

STG1702 by STMicroelectronics is a CMOS display controller with a 1280 x 1024 pixel configuration and a max clock frequency of 110 MHz. It features a quad terminal position in a compact chip carrier package. Ideal for high-resolution displays, it supports efficient data handling with an 8-bit external bus.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

-

-

-

-

Digiode

USA . 2,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,620

-

-

-

-

Anansix

USA . 2,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,478

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,482 parts In-Stock

1+ parts

$19.284

100+ parts

-

1k+ parts

$17.356

10k+ parts

-

1,482

$19.284

-

$17.356

-

MKK Technologies

India . 2,254 parts In-Stock

1+ parts

$36.263

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$36.263

-

-

-

DigiPath Technology Company

USA . 2,254 parts In-Stock

1+ parts

$36.263

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$36.263

-

-

-

Corohmni

South Africa . 589 parts In-Stock

1+ parts

$79.536

100+ parts

-

1k+ parts

-

10k+ parts

-

589

$79.536

-

-

-

Parana Technologies

USA . 2,278 parts In-Stock

1+ parts

-

100+ parts

$23.057

1k+ parts

-

10k+ parts

-

2,278

-

$23.057

-

-

Corphita

USA . 624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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624

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-

Overview

Elevate your display capabilities with the STG1702 from STMicroelectronics, a leader in innovation and quality. This advanced display controller delivers exceptional performance for high-resolution applications, ensuring vivid visuals and seamless interaction. Its reliable design and cutting-edge technology make it an ideal choice for everything from consumer electronics to industrial displays. Unlock the potential of your projects with STMicroelectronics’ commitment to excellence and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the reliability and longevity of the display controller.

Surface Mount: YES

Being surface mount allows for efficient space utilization on PCBs, making integration into compact devices easier.

Address Bus Width: 3

A 3-bit address bus enables a broader range of memory addressing, contributing to improved operational flexibility.

Package Shape: SQUARE

The square package shape ensures uniformity and simplifies layout design on circuit boards.

No. of Terminals: 44

With 44 terminals, this display controller supports a wide array of connections, enhancing its versatility in various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient heat dissipation and facilitates easier mounting on circuit boards.

Terminal Position: QUAD

Quad terminal positioning provides better routing options and reduces the complexity of PCB designs.

Display Config: 1280 X 1024 PIXELS

The high display resolution of 1280 x 1024 pixels allows for crisp visuals, making it ideal for high-quality displays.

Maximum Seated Height: 4.57 mm

A compact maximum seated height ensures compatibility with low-profile devices while enabling efficient space management.

Width: 16.5862 mm

The width dimension contributes to the compact form factor, allowing for more streamlined designs in smaller devices.

External Data Bus Width: 8

An 8-bit external data bus supports high-speed data transfer, improving the overall performance of the display controller.

Maximum Clock Frequency: 110 MHz

A maximum clock frequency of 110 MHz ensures rapid data processing, which is crucial for high-performance display operations.

Length: 16.5862 mm

The length of 16.5862 mm maintains a compact size, making it suitable for modern electronic applications with limited space.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Incorporating both display control and palette DAC functionality in one IC improves integration and reduces component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device efficient and reliable.

Terminal Form: J BEND

The J bend terminal form ensures a secure connection during soldering and enhances the stability of the PCB assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling during assembly.

Technical Specifications

Display Controllers STG1702 attributes and parameters. Explore more Display Controllers devices from STMicroelectronics

Specs

Address Bus Width:

3

Maximum Clock Frequency:

110 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Terminals:

44

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

STG1702 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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