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TLC34075-85AFNR

Texas Instruments

TLC34075-85AFNR by Texas Instruments

TLC34075-85AFNR by Texas Instruments is a display controller with 1024x768 pixels, CMOS technology, and 8-bit external data bus width. It operates b/w 0 to 70°C, suitable for commercial applications requiring high-resolution displays in compact spaces. The chip carrier package style with J bend terminals makes it ideal for surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,663 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,663

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Vyrian

USA . 2,535 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,333 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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10k+ parts

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1,333

$7.000

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$16.437

100+ parts

-

1k+ parts

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10k+ parts

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845

$16.437

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Parana Technologies

USA . 1,777 parts In-Stock

1+ parts

$31.691

100+ parts

-

1k+ parts

$86.720

10k+ parts

-

1,777

$31.691

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$86.720

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DigiPath Technology Company

USA . 112 parts In-Stock

1+ parts

$34.896

100+ parts

-

1k+ parts

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10k+ parts

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112

$34.896

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ChromeModa Solutions

Germany . 5,949 parts In-Stock

1+ parts

$35.608

100+ parts

$29.199

1k+ parts

-

10k+ parts

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5,949

$35.608

$29.199

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IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$35.608

100+ parts

$33.828

1k+ parts

$32.047

10k+ parts

-

858

$35.608

$33.828

$32.047

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Corohmni

South Africa . 5,123 parts In-Stock

1+ parts

$54.356

100+ parts

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1k+ parts

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10k+ parts

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5,123

$54.356

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Corphita

USA . 4,536 parts In-Stock

1+ parts

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100+ parts

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4,536

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Overview

Discover the TLC34075-85AFNR by Texas Instruments, a high-quality display controller perfect for a wide range of applications. With a commitment to excellence, Texas Instruments delivers reliable products that exceed expectations. This versatile chip carrier package offers customers unparalleled value, providing seamless integration and superior performance. Ideal for projects requiring precise display control, this product ensures optimal functionality and efficiency. Experience the benefits of cutting-edge technology with the TLC34075-85AFNR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage tolerance provides flexibility in power supply design and helps in preventing damage from voltage spikes.

Address Bus Width: 4

A wider address bus width allows for more memory addressing capabilities, enabling larger display configurations.

Package Shape: SQUARE

Square package shape is space-efficient and promotes easy placement on circuit boards.

No. of Terminals: 84

Higher number of terminals allow for more connections and functionalities within the display controller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and compact form factor, essential for modern electronic devices.

Minimum Supply Voltage: 4.75 V

A lower minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in cold environments without performance issues.

Display Config: 1024 X 768 PIXELS

High resolution display configuration provides sharp and clear images for a superior viewing experience.

Maximum Seated Height: 4.57 mm

Low seated height ensures the display controller can be incorporated into slim and compact device designs.

Width: 29.3116 mm

Compact width dimension allows for flexibility in placement within electronic devices.

External Data Bus Width: 8

Wider external data bus width enables faster data transfer and processing capabilities.

Length: 29.3116 mm

Compact length dimension for easy integration into various electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in typical operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Inclusion of integrated display controller and palette DAC enhances display functionalities and color accuracy.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

J bend terminal form allows for easy and secure connections during installation and maintenance.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch facilitates easier PCB layout and soldering, enhancing manufacturing efficiency.

Technical Specifications

Display Controllers TLC34075-85AFNR attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TLC34075-85AFNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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