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LC74782M

Onsemi

LC74782M by Onsemi

LC74782M by Onsemi is a display controller with 24 terminals, operating b/w -30 °C to 70°C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its small outline package and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,239 parts In-Stock

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Digiode

USA . 2,099 parts In-Stock

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2,099

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Problanco Electronics

Mexico . 4,829 parts In-Stock

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TANS Electronics

Latvia . 1,629 parts In-Stock

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Corphita

USA . 1,131 parts In-Stock

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SupplyDigital Components

Austria . 1,068 parts In-Stock

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Kulean Microsystems

USA . 237 parts In-Stock

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Corohmni

South Africa . 125 parts In-Stock

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UHIMA Technologies

Türkiye . 56 parts In-Stock

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Overview

Experience the next level of display control with the LC74782M by Onsemi. Designed with precision and expertise, this display controller offers unparalleled quality and performance for a wide range of applications. From graphic processors to small outline packages, this product delivers exceptional value and benefits to customers looking for reliable and efficient solutions. Upgrade your display systems with the LC74782M and unlock endless possibilities in visual technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and removal, making the product user-friendly.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space and easy integration into electronic devices.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with a wide range of devices and systems.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and versatility in usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and facilitates compact designs.

Maximum Operating Temperature: 70 °C

Operating at 70 °C ensures reliable performance under moderate to high temperature conditions.

Minimum Operating Temperature: -30 °C

Ability to operate at -30 °C makes the product suitable for use in cold environments.

Terminal Position: DUAL

Dual terminal position allows for increased connectivity options and flexibility in setup.

Peripheral IC Type: GRAPHICS PROCESSOR

Having a graphics processor helps in generating high-quality visuals and improving display performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and fast.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering, ensuring stable performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm allows for precise connections and efficient signal transmission.

Technical Specifications

Display Controllers LC74782M attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74782M Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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