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TLC34075-135FN

Texas Instruments

TLC34075-135FN by Texas Instruments

TLC34075-135FN by Texas Instruments is a display controller with 1024x768 pixels, 135 MHz clock frequency, and 8-bit external data bus width. It is used in commercial applications for driving displays efficiently at temperatures ranging from 0 to 70°C.

Median Price

$13.910

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$13.910

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Vyrian

USA . 7,740 parts In-Stock

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7,740

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Digiode

USA . 4,663 parts In-Stock

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4,663

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Standard Data Resources

USA . 367 parts In-Stock

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367

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Q Components

USA . 299 parts In-Stock

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299

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PAR Electronics

UK . 229 parts In-Stock

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J & M Industries LLC

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 772 parts In-Stock

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$10.438

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Parana Technologies

USA . 1,984 parts In-Stock

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$30.090

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$66.929

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One Stop Electronics

USA . 167 parts In-Stock

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$33.000

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DigiPath Technology Company

USA . 1,694 parts In-Stock

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$33.133

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ChromeModa Solutions

Germany . 2,231 parts In-Stock

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$33.809

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$27.723

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$27.723

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

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$33.809

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$32.119

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$30.428

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1,843

$33.809

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Corohmni

South Africa . 199 parts In-Stock

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$34.733

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Corphita

USA . 1,537 parts In-Stock

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Assy Fe

Spain . 23 parts In-Stock

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Eliminating Global Boundries, Inc

USA . 3 parts In-Stock

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Overview

Enhance your display control experience with the TLC34075-135FN by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-of-the-line solutions in the Display Controllers category. This versatile chip carrier package offers a wide range of applications, providing customers with superior performance and reliability. With a maximum clock frequency of 135 MHz and compatibility with TMS34010 and TMS34020 bus systems, this display controller is perfect for a variety of projects. Upgrade your display control capabilities today with the TLC34075-135FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into electronic devices.

Maximum Supply Voltage: 5.25 V

Support for a high maximum supply voltage enables compatibility with various power sources.

Address Bus Width: 4

A wider address bus width allows for efficient data processing and communication between components.

Package Shape: SQUARE

The square package shape offers a compact design for space-saving installation.

No. of Terminals: 84

Having a higher number of terminals provides versatility in connectivity options for various configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a reliable and secure housing for the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures efficient power usage and compatibility with different voltage levels.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in colder environments.

Terminal Position: QUAD

The quad terminal position offers a convenient layout for easy connection and installation.

Display Config: 1024 X 768 PIXELS

Support for high resolution display configuration enables sharp and detailed visual output.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for a slim and compact design for the overall electronic device.

Width: 29.31 mm

The moderate width provides a balance between space efficiency and connectivity options.

External Data Bus Width: 8

A wider external data bus width enables faster data transfer and processing capabilities.

Maximum Clock Frequency: 135 MHz

Support for a high maximum clock frequency ensures smooth and responsive display performance.

Length: 29.31 mm

The moderate length offers a compact form factor for easy integration into electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable and consistent performance in standard operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of display controller and palette DAC peripheral IC types enhances the functionality and versatility of the product.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity for reliable operation.

Terminal Form: J BEND

The J bend terminal form provides a secure and reliable connection for stable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures consistent and reliable power delivery for optimal performance.

Bus Compatibility: TMS34010; TMS34020

Compatibility with TMS34010 and TMS34020 bus systems allows for seamless integration and interoperability.

Terminal Pitch: 1.27 mm

The narrow terminal pitch enables a compact layout and efficient connectivity for the display controller.

Technical Specifications

Display Controllers TLC34075-135FN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Bus Compatibility:

TMS34010; TMS34020

Maximum Clock Frequency:

135 MHz

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.31 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

29.31 mm

Peripheral IC Type:

Trade Compliance

TLC34075-135FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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