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SM34061GB

Texas Instruments

SM34061GB by Texas Instruments

SM34061GB by Texas Instruments is a display controller with 68 terminals in a ceramic grid array package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes MOS technology with terminal pitch of 2.54mm, ideal for various display control applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,559 parts In-Stock

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5,559

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Digiode

USA . 1,124 parts In-Stock

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1,124

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$15.511

100+ parts

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829

$15.511

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One Stop Electronics

USA . 1,107 parts In-Stock

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$24.000

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1,107

$24.000

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Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

$34.838

100+ parts

$3,235.252

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$31.354

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1,607

$34.838

$3,235.252

$31.354

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DigiPath Technology Company

USA . 197 parts In-Stock

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$38.361

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197

$38.361

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ChromeModa Solutions

Germany . 3,117 parts In-Stock

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$39.144

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$32.098

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3,117

$39.144

$32.098

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IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$39.144

100+ parts

$37.187

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$35.230

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960

$39.144

$37.187

$35.230

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Corohmni

South Africa . 2,552 parts In-Stock

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$78.856

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2,552

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Corphita

USA . 2,081 parts In-Stock

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Overview

Elevate your display control capabilities with the SM34061GB by Texas Instruments. Known for its superior quality and reliability, Texas Instruments has a long-standing reputation as a leading manufacturer in the industry. The SM34061GB is a versatile display controller that offers seamless integration and exceptional performance across various applications. Experience the value and benefits of this product as it enhances efficiency and functionality in your projects. Unlock new possibilities with the SM34061GB and elevate your next display design to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and high mechanical strength, making it ideal for applications that require reliable performance in high-temperature environments.

No. of Terminals: 68

Having a higher number of terminals allows for more connectivity options and versatility in integrating the display controller with other components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this display controller can withstand higher temperatures without compromising its performance, ensuring reliability in various operating conditions.

Technology: MOS

MOS technology is known for its low power consumption and fast switching speeds, making this display controller energy-efficient and responsive, which is crucial for optimal display performance.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy connections and compatibility with standard connectors, making installation and maintenance of the display controller hassle-free.

Technical Specifications

Display Controllers SM34061GB attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SM34061GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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