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LC74794

Onsemi

LC74794 by Onsemi

LC74794 by Onsemi is a display controller with 30 terminals, operating at temperatures from -30 °C to 70°C. It features a 5V supply voltage and CMOS technology, suitable for graphics processing applications. The package is made of plastic/epoxy in a rectangular shape with an in-line, shrink pitch style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,709 parts In-Stock

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1,709

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Vyrian

USA . 95 parts In-Stock

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95

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,198 parts In-Stock

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8,198

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SupplyDigital Components

Austria . 2,950 parts In-Stock

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2,950

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Kulean Microsystems

USA . 2,371 parts In-Stock

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2,371

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Corphita

USA . 2,033 parts In-Stock

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2,033

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Corohmni

South Africa . 412 parts In-Stock

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412

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UHIMA Technologies

Türkiye . 358 parts In-Stock

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358

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Problanco Electronics

Mexico . 176 parts In-Stock

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Overview

Experience the cutting-edge technology of the LC74794 by Onsemi, a top-tier manufacturer known for its high-quality display controllers. This innovative product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From enhancing graphics processing to optimizing power supplies, this versatile device delivers exceptional value and benefits to customers looking to elevate their display systems. Trust Onsemi and the LC74794 to exceed your expectations and bring your visual experiences to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and lightweight design, making the display controller easy to handle and install.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and systems.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 30

Having 30 terminals provides flexibility in connections and options for interfacing with other components.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style allows for a compact design, saving space in electronic devices.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -30 °C

Capable of operating at -30 °C allows for usage in cold conditions without performance issues.

Peripheral IC Type: GRAPHICS PROCESSOR

Having a graphics processor enhances the display capabilities, making it suitable for high-resolution and advanced display requirements.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and efficient performance for the display controller.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong and reliable connections, ensuring stability in operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility and efficiency with common power sources.

Terminal Pitch: 1.78 mm

With a terminal pitch of 1.78mm, the display controller allows for easy and precise connections, enhancing reliability.

Technical Specifications

Display Controllers LC74794 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP30,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74794 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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