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TMX320F28027PTA

Texas Instruments

TMX320F28027PTA by Texas Instruments

TMX320F28027PTA by Texas Instruments is a 32-bit DSP with 60 MHz clock frequency, 1.71-1.995 V supply range, and 32768 ROM words. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact FLATPACK package with 48 terminals.

Median Price

$57.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 1 parts In-Stock

1+ parts

$57.690

100+ parts

$43.270

1k+ parts

$37.500

10k+ parts

-

1

$57.690

$43.270

$37.500

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Vyrian

USA . 4,959 parts In-Stock

1+ parts

-

100+ parts

-

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4,959

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Digiode

USA . 2,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,840

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 457 parts In-Stock

1+ parts

$14.276

100+ parts

-

1k+ parts

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457

$14.276

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One Stop Electronics

USA . 1,224 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

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1,224

$25.000

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Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

$38.222

100+ parts

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1,342

$38.222

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ChromeModa Solutions

Germany . 4,121 parts In-Stock

1+ parts

$42.946

100+ parts

$35.216

1k+ parts

-

10k+ parts

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4,121

$42.946

$35.216

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IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$42.946

100+ parts

$40.799

1k+ parts

$38.651

10k+ parts

-

418

$42.946

$40.799

$38.651

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Corohmni

South Africa . 2,413 parts In-Stock

1+ parts

$45.395

100+ parts

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1k+ parts

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2,413

$45.395

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Corphita

USA . 3,679 parts In-Stock

1+ parts

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3,679

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DigiPath Technology Company

USA . 1,873 parts In-Stock

1+ parts

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100+ parts

$38.720

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1,873

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$38.720

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Microchip USA

USA . 192 parts In-Stock

1+ parts

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192

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Overview

Elevate your digital signal processing capabilities with the Texas Instruments TMX320F28027PTA. Crafted by industry leader Texas Instruments, this DSP offers unparalleled quality and reliability. Ideal for a wide range of applications, this 32-bit powerhouse delivers exceptional performance and efficiency. With low power mode and boundary scan capabilities, this DSP is designed to enhance your projects while maximizing value. Upgrade your technology with the TMX320F28027PTA and experience the benefits of cutting-edge innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing production time and costs.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power input, catering to a wide range of applications.

Package Shape: SQUARE

The square package shape facilitates easier mounting and placement on circuit boards.

Bit Size: 32

A larger bit size enables higher processing capabilities and better performance for complex digital signal processing tasks.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages provides compatibility with various power sources and requirements.

No. of Terminals: 48

A sufficient number of terminals allow for connectivity to external components and peripherals, enhancing the versatility of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer flexibility in design and compatibility with different mounting configurations.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in demanding industrial environments with varying temperature conditions.

CPU Family: TMS320

Being part of the TMS320 CPU family indicates a legacy of quality, performance, and support for DSP applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position simplifies connections and enhances signal integrity when interfacing with other components.

ROM Words: 32768

Large ROM capacity allows for storing and executing complex algorithms and programs efficiently.

Maximum Seated Height: 1.6 mm

The low seated height saves space when mounting the DSP and allows for compact designs in electronic devices.

Width: 7 mm

With a compact width, the DSP can be accommodated in space-constrained designs without compromising performance.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP, simplifying the production and maintenance processes.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency ensures fast processing speeds and real-time performance for signal processing applications.

Internal Bus Architecture: MULTIPLE

Support for multiple internal bus architectures enhances data transfer efficiency and overall processing performance.

Length: 7 mm

The compact length of the DSP allows for integration into small form factor devices and circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports a broad range of digital signal processing applications and interfaces with various devices.

RAM Bytes: 12288

Ample RAM capacity enables efficient data storage and manipulation during signal processing operations, enhancing performance and functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making it ideal for power-efficient and high-performance DSP applications.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint strength and reliability, ensuring robust connections and long-term performance.

Nominal Supply Voltage: 1.8 V

The stable nominal supply voltage ensures consistent and reliable operation of the DSP across a wide range of operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing flexibility and adaptability in DSP applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch simplifies PCB layout and assembly, enabling high-density mounting and compact designs.

Format: FIXED POINT

Utilizing fixed-point format simplifies arithmetic operations and data processing, improving efficiency and accuracy in signal processing tasks.

Speed: 60 rpm

The high operating speed of 60 rpm ensures real-time processing capabilities for demanding signal processing applications.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends battery life in portable and power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F28027PTA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMX320F28027PTA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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