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TMX320C6748ZCE

Texas Instruments

TMX320C6748ZCE by Texas Instruments

TMX320C6748ZCE by Texas Instruments is a 16-bit DSP with 24-bit address bus width, operating at a max clock frequency of 50 MHz. It features low power mode and CMOS technology, making it ideal for digital signal processing applications requiring high-speed data processing in compact designs.

Median Price

$36.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 82 parts In-Stock

1+ parts

$36.630

100+ parts

$28.080

1k+ parts

-

10k+ parts

-

82

$36.630

$28.080

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,643 parts In-Stock

1+ parts

$26.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,643

$26.990

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-

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Vyrian

USA . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,525

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,637 parts In-Stock

1+ parts

$25.569

100+ parts

-

1k+ parts

-

10k+ parts

-

1,637

$25.569

-

-

-

Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

$43.284

100+ parts

-

1k+ parts

-

10k+ parts

-

2,289

$43.284

-

-

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DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

$47.661

100+ parts

$43.848

1k+ parts

-

10k+ parts

-

1,491

$47.661

$43.848

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-

ChromeModa Solutions

Germany . 3,681 parts In-Stock

1+ parts

$48.634

100+ parts

$39.880

1k+ parts

-

10k+ parts

-

3,681

$48.634

$39.880

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-

IDEA Electronic Components Group

UK . 414 parts In-Stock

1+ parts

$48.634

100+ parts

$46.202

1k+ parts

$43.771

10k+ parts

-

414

$48.634

$46.202

$43.771

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$60.011

100+ parts

$54.610

1k+ parts

$49.209

10k+ parts

-

5,000

$60.011

$54.610

$49.209

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Corohmni

South Africa . 827 parts In-Stock

1+ parts

$62.461

100+ parts

-

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10k+ parts

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827

$62.461

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Microchip USA

USA . 330 parts In-Stock

1+ parts

$64.220

100+ parts

$63.100

1k+ parts

$62.540

10k+ parts

$61.980

330

$64.220

$63.100

$62.540

$61.980

Lixinc

USA . 7,434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,434

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Overview

Unlock the power of cutting-edge technology with the TMX320C6748ZCE by Texas Instruments, a top-of-the-line Digital Signal Processor designed to revolutionize your projects. With Texas Instruments' reputation for excellence in manufacturing, this DSP guarantees unmatched quality and reliability. Ideal for a wide range of applications, from audio processing to telecommunications, this product offers customers exceptional value, efficiency, and performance. Experience seamless integration, superior functionality, and endless possibilities with the TMX320C6748ZCE - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various environments.

Surface Mount: YES

Ease of installation and compatibility with modern PCB design standards.

Maximum Supply Voltage: 1.32 V

Efficient power utilization and stability within specified operating conditions.

Address Bus Width: 24

Ability to access a large memory address space for complex signal processing tasks.

Package Shape: SQUARE

Space-saving design that allows for efficient placement on circuit boards.

Bit Size: 16

Suitable for handling digital signal processing tasks with precision and accuracy.

Power Supplies (V): 1.2,1.8,3.3

Offers flexibility in power input options for different applications and requirements.

No. of Terminals: 361

Provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhanced reliability, compact size, and ease of integration into circuit layouts.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even under low voltage conditions.

Terminal Position: BOTTOM

Facilitates easy PCB layout and assembly process.

Maximum Seated Height: 1.3 mm

Low profile design for space-constrained applications.

RAM Words: 16384

Sufficient memory capacity for storing and processing data efficiently.

Width: 13 mm

Compact form factor for versatile placement options on PCBs.

Boundary Scan: YES

Simplifies testing and debugging processes during development and production.

External Data Bus Width: 16

Optimal data transfer capabilities for high-speed processing tasks.

Maximum Clock Frequency: 50 MHz

Suitable for real-time signal processing and fast computation requirements.

Internal Bus Architecture: MULTIPLE

Efficient data flow management within the DSP for improved performance.

Length: 13 mm

Complements the compact width for space-efficient PCB design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC support for diverse signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Enhanced mechanical strength and durability for long-term use.

Nominal Supply Voltage: 1.2 V

Stable and efficient operation at the recommended voltage level.

Terminal Pitch: 0.65 mm

Fine pitch design for compact layout and connectivity solutions.

Format: FLOATING POINT

Support for floating-point arithmetic precision in signal processing algorithms.

Low Power Mode: YES

Energy-efficient operation to minimize power consumption and heat generation.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C6748ZCE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMX320C6748ZCE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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