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TMS320DM8127BCYED3

Texas Instruments

TMS320DM8127BCYED3 by Texas Instruments

TMS320DM8127BCYED3 by Texas Instruments is a 32-bit microprocessor with 28-bit address bus, 16-bit external data bus, and integrated cache. It operates at max frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating point format. The package style is grid array with fine pitch terminals, making it ideal for high-speed processing tasks.

Median Price

$34.436

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 785 parts In-Stock

1+ parts

-

100+ parts

$30.610

1k+ parts

$27.390

10k+ parts

$25.780

785

-

$30.610

$27.390

$25.780

DigiKey

USA . 785 parts In-Stock

1+ parts

-

100+ parts

-

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785

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Verical

USA . 460 parts In-Stock

1+ parts

-

100+ parts

$38.263

1k+ parts

$34.237

10k+ parts

$32.225

460

-

$38.263

$34.237

$32.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,522 parts In-Stock

1+ parts

$32.319

100+ parts

-

1k+ parts

-

10k+ parts

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4,522

$32.319

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-

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DigiKey Marketplace

USA . 835 parts In-Stock

1+ parts

$35.380

100+ parts

-

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835

$35.380

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Vyrian

USA . 6,944 parts In-Stock

1+ parts

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6,944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,056 parts In-Stock

1+ parts

$25.116

100+ parts

-

1k+ parts

$25.787

10k+ parts

-

2,056

$25.116

-

$25.787

-

ChromeModa Solutions

Germany . 5,732 parts In-Stock

1+ parts

$28.220

100+ parts

$23.140

1k+ parts

-

10k+ parts

-

5,732

$28.220

$23.140

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-

IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$28.220

100+ parts

$26.809

1k+ parts

$25.398

10k+ parts

-

709

$28.220

$26.809

$25.398

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Corphita

USA . 1,221 parts In-Stock

1+ parts

$30.618

100+ parts

-

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1,221

$30.618

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QUARKTWIN TECHNOLOGY LTD

USA . 25,510 parts In-Stock

1+ parts

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25,510

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

-

100+ parts

$25.443

1k+ parts

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10k+ parts

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595

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$25.443

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Overview

Experience unparalleled performance and reliability with the TMS320DM8127BCYED3 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers cutting-edge solutions that exceed industry standards. This powerful microprocessor is perfect for a wide range of applications, offering seamless integration, efficient operation, and top-notch quality. Trust Texas Instruments to provide the best value for your investment and unlock a world of possibilities with the TMS320DM8127BCYED3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microprocessor by reducing access times to frequently used data.

Maximum Supply Voltage: 1.42 V

The higher maximum supply voltage allows for more flexibility in power supply options, catering to different system requirements.

Address Bus Width: 28

A larger address bus width allows the microprocessor to access a greater range of memory locations, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape can make it easier to integrate the microprocessor into various system designs, maximizing space efficiency.

Bit Size: 32

A 32-bit microprocessor can handle larger chunks of data at once, leading to faster processing speeds and improved overall performance.

No. of Terminals: 684

Having a high number of terminals allows for a greater amount of connectivity options, enabling the microprocessor to interact with various system components.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures the microprocessor can withstand demanding thermal conditions without compromising performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high speed capabilities, making it an efficient choice for a microprocessor.

Technical Specifications

Microprocessors TMS320DM8127BCYED3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYED3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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