Loading...

TMS320DM642AZDK7HK

Texas Instruments

TMS320DM642AZDK7HK by Texas Instruments

TMS320DM642AZDK7HK by Texas Instruments is a DSP with 64-bit external data bus, 20-bit address bus, and CMOS technology. It operates b/w 0-90°C, has low power mode, and uses grid array package style. Ideal for digital signal processing applications requiring high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,441

-

-

-

-

Digiode

USA . 2,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,315

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 646 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

646

$18.000

-

-

-

AZTECH Wire

Italy . 412 parts In-Stock

1+ parts

$19.634

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$19.634

-

-

-

Parana Technologies

USA . 149 parts In-Stock

1+ parts

$45.156

100+ parts

$4,193.413

1k+ parts

$40.640

10k+ parts

-

149

$45.156

$4,193.413

$40.640

-

DigiPath Technology Company

USA . 1,009 parts In-Stock

1+ parts

$49.722

100+ parts

$45.744

1k+ parts

-

10k+ parts

-

1,009

$49.722

$45.744

-

-

ChromeModa Solutions

Germany . 4,446 parts In-Stock

1+ parts

$50.737

100+ parts

$41.604

1k+ parts

-

10k+ parts

-

4,446

$50.737

$41.604

-

-

IDEA Electronic Components Group

UK . 731 parts In-Stock

1+ parts

$50.737

100+ parts

$48.200

1k+ parts

$45.663

10k+ parts

-

731

$50.737

$48.200

$45.663

-

Corohmni

South Africa . 180 parts In-Stock

1+ parts

$63.218

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$63.218

-

-

-

Corphita

USA . 4,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,395

-

-

-

-

Overview

Experience unparalleled performance and reliability with the TMS320DM642AZDK7HK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted this Digital Signal Processor to exceed expectations in various applications. From audio processing to image recognition, this DSP offers exceptional value and benefits for customers seeking cutting-edge technology. Trust in Texas Instruments to deliver quality products that provide advantages in efficiency, speed, and precision. Elevate your projects with the TMS320DM642AZDK7HK and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into electronic circuits.

Maximum Supply Voltage: 1.44 V

Provides the necessary power for the DSP to operate efficiently.

Address Bus Width: 20

A wider address bus width allows for more memory addressing capabilities, enhancing the DSP's performance in data processing tasks.

Package Shape: SQUARE

Square shape helps in efficient utilization of space on the circuit board.

No. of Terminals: 548

Having a high number of terminals enables connectivity with numerous external components, increasing the versatility of the DSP.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style facilitates high-density mounting, making the product suitable for applications where space is a constraint.

Minimum Supply Voltage: 1.36 V

Even at low supply voltage, the DSP can maintain its operational stability, ensuring reliable performance.

Maximum Operating Temperature: 90 °C

Capable of operating in high-temperature environments without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Can function in cold temperatures, providing versatility for use in various environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This finish is corrosion-resistant and promotes good electrical conductivity, enhancing the overall reliability of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections on the circuit board.

Maximum Seated Height: 2.5 mm

Low seated height enables the DSP to be integrated into compact devices or systems.

Width: 23 mm

A moderate width facilitates easy mounting and placement on the circuit board.

Boundary Scan: YES

Boundary scan capability is useful for testing and debugging the DSP during manufacturing or maintenance processes.

External Data Bus Width: 64

A wide external data bus width allows for fast data transfer and processing, enhancing the DSP's performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient communication between different components within the DSP, optimizing data flow and processing speed.

Length: 23 mm

Compact length facilitates space-saving design and integration into small devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a specialized digital signal processor, this product is designed to handle data processing tasks efficiently, making it a suitable choice for applications requiring signal processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form provides a reliable and secure connection, ensuring stable performance of the DSP in the circuit.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance of the DSP under normal operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and efficient use of board space.

Format: FIXED POINT

Fixed-point format is suitable for applications where precision in numerical calculations is required, making this DSP ideal for such tasks.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the DSP can withstand moderate levels of moisture exposure, ensuring reliability in various environmental conditions.

Low Power Mode: YES

Low power mode enhances energy efficiency, making the DSP ideal for battery-operated devices or applications where power consumption is a concern.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AZDK7HK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AZDK7HK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20