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TMS29F040-90C5FML

Texas Instruments

TMS29F040-90C5FML by Texas Instruments

TMS29F040-90C5FML by Texas Instruments is a 512Kx8 NOR flash memory chip with 3-STATE output. Operating at 5V, it offers 100000 Write/Erase Cycles endurance and has a max access time of 90ns. Ideal for applications requiring fast, reliable data storage in commercial temperature environments.

Median Price

$1.813

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

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Rochester

USA . 389 parts In-Stock

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$1.620

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$1.450

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$1.370

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$1.370

DigiKey

USA . 389 parts In-Stock

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$2.140

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Verical

USA . 389 parts In-Stock

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$1.813

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$1.712

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$1.712

Distributors (In-Stock)

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Digiode

USA . 524 parts In-Stock

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$1.720

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Greenchips

USA . 31 parts In-Stock

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$1.805

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$1.700

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$1.530

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$1.530

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$1.530

Bristol Electronics

USA . 871 parts In-Stock

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$2.855

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$1.342

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$1.228

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$1.228

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$11.590

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Vyrian

USA . 6,453 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Lighthouse Electronics, Inc.

USA . 1,381 parts In-Stock

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Dan-Mar Components

USA . 871 parts In-Stock

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Legend Electronics Inc.

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DigiKey Marketplace

USA . 389 parts In-Stock

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Velocity Electronics

USA . 346 parts In-Stock

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PC Components Company LLC

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A2Z Electronics, Inc.

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Prism Electronics

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Odintec Ltd.

Israel . 98 parts In-Stock

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Microfarads

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Corel Iberica Componentes, S.L.

Spain . 48 parts In-Stock

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ABC Electronics Ltd.

UK . 47 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 31 parts In-Stock

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Q Components

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ARCO, INC.

USA . 22 parts In-Stock

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Cyclops Electronics Ltd

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Distributors (Availability)

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Corphita

USA . 633 parts In-Stock

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$1.629

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$1.629

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Parana Technologies

USA . 2,226 parts In-Stock

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$2.417

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$2.914

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$2.662

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$2.449

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IDEA Electronic Components Group

UK . 603 parts In-Stock

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ChromeModa Solutions

Germany . 98 parts In-Stock

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$2.716

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$2.227

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$6.184

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$5.627

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$5.071

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QUARKTWIN TECHNOLOGY LTD

USA . 15,572 parts In-Stock

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Kepictronics

USA . 6,737 parts In-Stock

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Metaverse IC Inc.

Canada . 6,737 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Assy Fe

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Overview

Experience unparalleled reliability and performance with the TMS29F040-90C5FML by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality flash memory solutions that cater to various applications. This chip carrier package offers 512Kx8 organization, 8 sectors with 64K words each, and 100,000 write/erase cycles endurance. With a nominal supply voltage of 5V and maximum operating temperature of 70°C, this NOR type flash memory provides fast access time of 90 ns and low standby current of 0.0001 Amp. Trust Texas Instruments to provide cutting-edge technology that guarantees seamless operation and exceptional value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the flash memory durable and resistant to damage, ensuring reliable performance in various environments.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for efficient data access and retrieval, enhancing the overall speed and performance of the flash memory.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, allowing for easy integration and communication with other components in the system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the flash memory can function reliably in a wide range of temperature conditions, making it versatile for various applications.

Memory Density: 4194304 bit

The high memory density of 4194304 bits allows for storing a large amount of data in a compact form factor, making it ideal for applications requiring high storage capacity.

Technical Specifications

Flash Memory TMS29F040-90C5FML attributes and parameters. Explore more Flash Memory devices from Texas Instruments

Specs

Maximum Access Time:

90 ns

Additional Features:

100000 PROGRAM/ERASE CYCLES

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQCC-J32

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

TMS29F040-90C5FML Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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