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TLC532AIN3

Texas Instruments

TLC532AIN3 by Texas Instruments

TLC532AIN3 by Texas Instruments is an 8-bit A/D converter with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and has a through-hole terminal form. This CMOS technology device comes in a rectangular plastic/epoxy package, making it suitable for various analog-to-digital conversion applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,324 parts In-Stock

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4,324

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Digiode

USA . 1,067 parts In-Stock

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1,067

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Distributors (Availability)

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One Stop Electronics

USA . 279 parts In-Stock

1+ parts

$2.000

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-

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279

$2.000

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AZTECH Wire

Italy . 454 parts In-Stock

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$5.866

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454

$5.866

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Parana Technologies

USA . 1,930 parts In-Stock

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$9.468

100+ parts

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$10.079

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1,930

$9.468

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$10.079

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ChromeModa Solutions

Germany . 3,096 parts In-Stock

1+ parts

$10.638

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$8.723

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3,096

$10.638

$8.723

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

1+ parts

$10.638

100+ parts

$10.106

1k+ parts

$9.574

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1,107

$10.638

$10.106

$9.574

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Corphita

USA . 374 parts In-Stock

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374

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DigiPath Technology Company

USA . 62 parts In-Stock

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$9.591

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62

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$9.591

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Overview

Unlock the power of precise data conversion with the TLC532AIN3 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers top-quality products that meet the demands of industrial applications. With its 8-bit resolution and industrial temperature grade, this A/D converter offers unparalleled accuracy and reliability. Trust in Texas Instruments to provide the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and protection for the internal components of the converter, ensuring reliable performance over time.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate this converter into various electronic systems or circuits.

No. of Bits: 8

8-bit resolution allows for decent level of accuracy in conversion, suitable for many general purpose applications.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of systems and configurations.

Package Style (Meter): IN-LINE

In-line package style makes it convenient to install and connect the converter in a system, saving space and reducing installation complexity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in potentially harsh industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the converter can function even in cold environments without issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable performance.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent operation and compatibility with common power sources.

Output Bit Code: OFFSET BINARY

Offset binary output coding provides a simple and efficient way to represent analog signals digitally, making data processing easier.

Technical Specifications

Analog-to-Digital Converters TLC532AIN3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Electrical Specifications

Power Supplies:

5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Trade Compliance

TLC532AIN3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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