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TLC549IDRG4

Texas Instruments

TLC549IDRG4 by Texas Instruments

TLC549IDRG4 by Texas Instruments is an 8-bit ADC with 0.1953% max linearity error, 17us conversion time, and 0.04MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 9,200 parts In-Stock

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Vyrian

USA . 7,717 parts In-Stock

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Digiode

USA . 3,984 parts In-Stock

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3,984

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Parana Technologies

USA . 1,048 parts In-Stock

1+ parts

$5.671

100+ parts

-

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$6.465

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1,048

$5.671

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$6.465

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DigiPath Technology Company

USA . 549 parts In-Stock

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$6.245

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$5.745

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549

$6.245

$5.745

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ChromeModa Solutions

Germany . 5,035 parts In-Stock

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$6.372

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$5.225

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$6.372

$5.225

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

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$6.372

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$5.735

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$6.372

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$5.735

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AZTECH Wire

Italy . 616 parts In-Stock

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$15.543

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$15.543

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Semicontronic

India . 1,611 parts In-Stock

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$20.000

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$19.500

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$19.400

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Corohmni

South Africa . 17 parts In-Stock

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$26.219

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One Stop Electronics

USA . 326 parts In-Stock

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$32.000

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Ampacity Inc.

Singapore . 887 parts In-Stock

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$35.000

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Kepictronics

USA . 32,140 parts In-Stock

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Microchip USA

USA . 5,267 parts In-Stock

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Argo Parts USA

USA . 2,539 parts In-Stock

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Corphita

USA . 1,465 parts In-Stock

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Continental Prestige Electronics

USA . 1,090 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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700

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Bastille Electronics

Australia . 48 parts In-Stock

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Overview

Looking for top-notch analog-to-digital converters? Look no further than the TLC549IDRG4 by Texas Instruments! With a reputation for quality and reliability, Texas Instruments delivers exceptional products like the TLC549IDRG4 for a wide range of applications. This small outline package offers customers high value with its precision, speed, and industrial-grade temperature range. Upgrade your system with the TLC549IDRG4 and experience the benefits of Texas Instruments' cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the ADC.

No. of Bits: 8

8-bit resolution allows for precise digital representation of analog signals, suitable for many applications.

Maximum Linearity Error (EL): 0.1953 %

Low linearity error ensures accurate conversion of analog signals to digital values.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this ADC suitable for industrial applications.

Maximum Conversion Time: 17 us

Fast conversion time allows for rapid sampling of analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC efficient and reliable.

Output Format: SERIAL

Serial output format enables easy integration with digital systems and microcontrollers.

Technical Specifications

Analog-to-Digital Converters TLC549IDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC549IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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