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TLC5510IPWG4

Texas Instruments

TLC5510IPWG4 by Texas Instruments

TLC5510IPWG4 by Texas Instruments is an 8-bit analog-to-digital converter (ADC) with a sample rate of 20 MHz. It operates at a supply voltage of 5V and has a max linearity error of 0.3906%. This ADC is commonly used in applications requiring high-speed and accurate conversion of analog signals to digital format.

Median Price

$7.612

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$6.090

1k+ parts

$5.450

10k+ parts

$5.130

115

-

$6.090

$5.450

$5.130

DigiKey

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$8.010

1k+ parts

-

10k+ parts

-

115

-

$8.010

-

-

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$7.612

1k+ parts

$6.813

10k+ parts

$6.412

115

-

$7.612

$6.813

$6.412

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$3.840

100+ parts

-

1k+ parts

-

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200

$3.840

-

-

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Digiode

USA . 3,849 parts In-Stock

1+ parts

$4.094

100+ parts

-

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-

10k+ parts

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3,849

$4.094

-

-

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Vyrian

USA . 2,649 parts In-Stock

1+ parts

-

100+ parts

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2,649

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DigiKey Marketplace

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 115 parts In-Stock

1+ parts

$3.660

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$3.660

-

-

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Continental Prestige Electronics

USA . 4,782 parts In-Stock

1+ parts

$3.840

100+ parts

-

1k+ parts

-

10k+ parts

$3.763

4,782

$3.840

-

-

$3.763

Argo Parts USA

USA . 4,176 parts In-Stock

1+ parts

$3.840

100+ parts

-

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10k+ parts

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4,176

$3.840

-

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Corphita

USA . 1,460 parts In-Stock

1+ parts

$3.879

100+ parts

-

1k+ parts

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10k+ parts

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1,460

$3.879

-

-

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AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$12.143

100+ parts

-

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764

$12.143

-

-

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Parana Technologies

USA . 333 parts In-Stock

1+ parts

$24.761

100+ parts

-

1k+ parts

$25.432

10k+ parts

-

333

$24.761

-

$25.432

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DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$27.265

100+ parts

$25.083

1k+ parts

-

10k+ parts

-

2,006

$27.265

$25.083

-

-

ChromeModa Solutions

Germany . 4,023 parts In-Stock

1+ parts

$27.821

100+ parts

$22.813

1k+ parts

-

10k+ parts

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4,023

$27.821

$22.813

-

-

IDEA Electronic Components Group

UK . 334 parts In-Stock

1+ parts

$27.821

100+ parts

$26.430

1k+ parts

$25.039

10k+ parts

-

334

$27.821

$26.430

$25.039

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.763

1k+ parts

$3.648

10k+ parts

$3.571

1,000

-

$3.763

$3.648

$3.571

Overview

Experience the superior quality and precision of the TLC5510IPWG4 Analog-to-Digital Converter by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers exceptional products that meet the highest standards. The TLC5510IPWG4 offers countless applications in various industries, providing accurate and reliable conversion from analog to digital signals. With its compact design and advanced technology, this converter ensures optimal performance and efficiency. Unlock the full potential of your projects with the TLC5510IPWG4, and enjoy the value, benefits, and advantages it brings to your work.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product’s plastic/epoxy package body material offers durability and protection for the internal components, making it suitable for various environments and applications.

No. of Analog In Channels:

1 - With a single analog input channel, this product efficiently converts analog signals to digital, making it suitable for single-channel applications where precision and accuracy are required.

Surface Mount:

YES - The surface mount capability of this product allows for easy integration onto circuit boards, minimizing space requirements and facilitating efficient assembly processes.

No. of Functions:

1 - With a single function, this product simplifies design and implementation, providing a cost-effective solution for applications that only require a single analog-to-digital conversion.

Package Shape:

RECTANGULAR - The rectangular package shape of this product allows for easy placement and efficient use of board space in various electronic designs, enhancing flexibility and usability.

No. of Bits:

8 - Featuring 8 bits, this analog-to-digital converter provides a resolution of 256 discrete levels, ensuring accurate and precise digital representation of analog signals, perfect for applications with moderate resolution requirements.

Maximum Linearity Error (EL):

0.3906% - This product boasts a low maximum linearity error, ensuring accurate conversion and minimal distortion, making it ideal for applications where high precision and linearity are crucial.

Power Supplies (V):

5 - With a power supply of 5 volts, this product is compatible with commonly used voltage sources, enabling easy integration into existing systems and reducing compatibility issues.

No. of Terminals:

24 - The numerous terminals of this product provide connectivity options for various signals and components, offering enhanced versatility and allowing for seamless integration with complex circuitry.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This compact package style facilitates efficient board layout and allows for compact and space-saving designs, making it suitable for applications with limited space constraints.

Maximum Operating Temperature:

75 °C - With a maximum operating temperature of 75°C, this product can withstand higher temperatures, providing reliability and stability in demanding environments.

Minimum Operating Temperature:

20 °C - This product's ability to operate at low temperatures down to -20°C makes it suitable for use in a wide range of environments, including those with extreme temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The terminal finish of this product with nickel, palladium, and gold ensures excellent conductivity, corrosion resistance, and long-term reliability, guaranteeing optimal performance and durability.

Terminal Position:

DUAL - Featuring a dual terminal position, this product offers multiple options for connection, enhancing versatility and accommodating various circuit design requirements.

Maximum Seated Height:

1.2 mm - With a maximum seated height of 1.2 mm, this product is compact and low-profile, enabling it to be used in applications with restricted vertical space while ensuring ease of integration.

Width:

4.4 mm - The narrow width of this product allows for efficient utilization of PCB real estate, making it suitable for space-constrained designs where minimizing dimensions is essential.

Maximum Time At Peak Reflow Temperature (s):

30 - This product can withstand a maximum time of 30 seconds at peak reflow temperature, ensuring reliability during the soldering process and facilitating efficient manufacturing.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability of 260°C ensures proper soldering and reliability during the assembly process, meeting industry standards and requirements.

Length:

7.8 mm - The compact length of this product enables space-saving integration, making it suitable for applications where miniaturization and PCB size reduction are essential.

Temperature Grade:

COMMERCIAL EXTENDED - With a commercial extended temperature grade, this product offers a wide operating temperature range and can withstand extended usage in commercial applications without compromising performance.

Maximum Analog Input Voltage:

2 V - Supporting a maximum analog input voltage of 2 volts, this product accommodates a wide range of analog signal levels, making it suitable for various applications with different voltage requirements.

Sample Rate:

20 MHz - This product's sample rate of 20 megahertz allows for fast and accurate conversion of analog signals to digital, making it ideal for applications where high-speed data acquisition is essential.

Technology:

CMOS - Based on CMOS technology, this product offers low power consumption, low noise, and high integration capabilities, ensuring efficient and reliable analog-to-digital conversion.

Terminal Form:

GULL WING - The gull wing terminal form of this product provides secure and reliable soldering connections, facilitating ease of assembly and ensuring long-term performance and connection stability.

Converter Type:

ADC, FLASH METHOD - This product employs a flash method ADC (Analog-to-Digital Converter), which offers high-speed conversion and minimal latency, making it ideal for applications requiring real-time data acquisition.

Nominal Supply Voltage:

5 V - With a nominal supply voltage of 5 volts, this product is compatible with standard power sources, simplifying integration and ensuring a reliable power operation.

Output Bit Code:

BINARY - This product utilizes binary output bit code, ensuring straightforward interpretation and compatibility with digital systems, making it suitable for a wide range of digital applications.

Terminal Pitch:

0.65 mm - The fine terminal pitch of 0.65 mm allows for high-density packaging and facilitates effective utilization of PCB space, making it suitable for applications with high component count and miniaturization requirements.

Minimum Analog Input Voltage:

0 V - Supporting a minimum analog input voltage of 0 volts, this product can accurately convert analog signals, including zero-level signals, making it applicable to various signal ranges.

Output Format:

PARALLEL, 8 BITS - The parallel output format with 8 bits simplifies data handling and ensures compatibility with parallel data interfaces, making it suitable for applications requiring straightforward data transfer.

Sample and Hold/Track and Hold:

SAMPLE - This product features a sample and hold mechanism, allowing it to capture and preserve precise analog samples, facilitating accurate and consistent digital conversion for applications requiring stable and reproducible results.

Moisture Sensitivity Level (MSL):

2 - With moisture sensitivity level 2, this product can withstand typical levels of moisture exposure during storage and assembly, ensuring durability and performance under normal operating conditions.

Technical Specifications

Analog-to-Digital Converters TLC5510IPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

75 °C (167 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.307 in (7.8 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP24,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC5510IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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