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TLC540IDWRG4

Texas Instruments

TLC540IDWRG4 by Texas Instruments

TLC540IDWRG4 by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 5V power supply. Ideal for industrial applications, it offers a sample rate of 0.07518 MHz and operates b/w -40 to 85°C. With a small outline package style, it is suitable for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,537 parts In-Stock

1+ parts

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4,537

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Vyrian

USA . 2,437 parts In-Stock

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2,437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 582 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

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10k+ parts

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582

$3.000

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$9.674

100+ parts

-

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627

$9.674

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Parana Technologies

USA . 2,166 parts In-Stock

1+ parts

$18.607

100+ parts

$1,727.964

1k+ parts

$16.747

10k+ parts

-

2,166

$18.607

$1,727.964

$16.747

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DigiPath Technology Company

USA . 2,150 parts In-Stock

1+ parts

$20.489

100+ parts

$18.850

1k+ parts

-

10k+ parts

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2,150

$20.489

$18.850

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ChromeModa Solutions

Germany . 5,228 parts In-Stock

1+ parts

$20.907

100+ parts

$17.144

1k+ parts

-

10k+ parts

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5,228

$20.907

$17.144

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IDEA Electronic Components Group

UK . 1,629 parts In-Stock

1+ parts

$20.907

100+ parts

$19.862

1k+ parts

$18.816

10k+ parts

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1,629

$20.907

$19.862

$18.816

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Corphita

USA . 2,085 parts In-Stock

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2,085

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Overview

Upgrade your analog-to-digital conversion experience with the TLC540IDWRG4 by Texas Instruments. This high-quality ADC offers precision and reliability, thanks to Texas Instruments' renowned manufacturing standards. Perfect for applications requiring accurate data conversion, this small-outline package device boasts 11 analog input channels and a fast conversion time of just 9 microseconds. Trust in Texas Instruments to deliver the value and performance you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

No. of Analog In Channels: 11

With 11 analog input channels, this product offers flexibility and versatility in capturing multiple analog signals.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on PCB.

No. of Bits: 8

8-bit resolution allows for adequate accuracy in converting analog signals to digital data.

Power Supplies (V): 5

Operating at a standard 5V power supply, this product is compatible with many systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications where temperature variations are common.

Technology: CMOS

CMOS technology ensures low power consumption and reliable performance.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type provides accurate conversion results with a fast conversion time of 9us.

Technical Specifications

Analog-to-Digital Converters TLC540IDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

75.18 kHz

Hold Mode:

Sample

Maximum Conversion Time:

9 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC540IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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