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TLC5510INSRG4

Texas Instruments

TLC5510INSRG4 by Texas Instruments

TLC5510INSRG4 by Texas Instruments is an 8-bit ADC with 20 MHz sample rate, 0.3906% linearity error, and 5V supply voltage. Ideal for applications requiring fast analog-to-digital conversion like industrial automation and sensor interfacing. Package: SOIC-24, Temp Range: -20 to 75°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,623 parts In-Stock

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Digiode

USA . 2,290 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Cyclops Electronics Ltd

UK . 7 parts In-Stock

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AZTECH Wire

Italy . 673 parts In-Stock

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$10.562

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One Stop Electronics

USA . 1,061 parts In-Stock

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$15.000

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Parana Technologies

USA . 1,135 parts In-Stock

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$17.705

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$1,644.156

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$15.934

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$1,644.156

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DigiPath Technology Company

USA . 1,905 parts In-Stock

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$19.495

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$19.495

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ChromeModa Solutions

Germany . 5,895 parts In-Stock

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$19.893

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$16.312

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IDEA Electronic Components Group

UK . 2,232 parts In-Stock

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$19.893

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$18.898

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$17.904

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Ampacity Inc.

Singapore . 551 parts In-Stock

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$33.000

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Kepictronics

USA . 14,350 parts In-Stock

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Continental Prestige Electronics

USA . 5,014 parts In-Stock

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Corphita

USA . 3,306 parts In-Stock

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Argo Parts USA

USA . 2,478 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of precision with the TLC5510INSRG4 Analog-to-Digital Converter by Texas Instruments. Designed with top-notch quality and expertise, this product offers unparalleled accuracy and reliability for your analog-to-digital conversion needs. Perfect for a wide range of applications, this converter provides customers with value, efficiency, and advanced performance. Experience the advantages of Texas Instruments technology and elevate your projects to new heights with the TLC5510INSRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and cost-effectiveness.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and facilitating automated assembly processes.

No. of Bits: 8

Provides sufficient resolution for most analog-to-digital conversion applications.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with many existing systems.

Maximum Operating Temperature: 75 °C

Can withstand high temperature environments, ensuring reliable performance in various conditions.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, enhancing efficiency and speed of operation.

Output Format: PARALLEL, 8 BITS

Provides data output in parallel format with 8 bits, allowing for easy interfacing with other digital systems.

Technical Specifications

Analog-to-Digital Converters TLC5510INSRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

75 °C (167 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.591 in (15 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.3

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC5510INSRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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