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TLC5510INSG4

Texas Instruments

TLC5510INSG4 by Texas Instruments

TLC5510INSG4 by Texas Instruments is an 8-bit ADC with 20 MHz sample rate, 0.3906% linearity error, and 5V supply voltage. Ideal for applications requiring fast analog-to-digital conversion like sensor data acquisition in commercial electronics. Package: SOIC-24, Temp Range: -20 to 75°C, Tech: CMOS.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,752 parts In-Stock

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Digiode

USA . 2,919 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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One Stop Electronics

USA . 626 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 607 parts In-Stock

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$10.455

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Parana Technologies

USA . 514 parts In-Stock

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$13.872

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$14.350

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Ampacity Inc.

Singapore . 804 parts In-Stock

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$15.000

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$15.000

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DigiPath Technology Company

USA . 1,129 parts In-Stock

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$15.274

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ChromeModa Solutions

Germany . 3,705 parts In-Stock

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$15.586

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$12.781

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

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$15.586

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$14.807

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$14.027

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Continental Prestige Electronics

USA . 2,518 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Discover the cutting-edge TLC5510INSG4 Analog-to-Digital Converter by Texas Instruments, designed with precision and quality in mind. This versatile product opens up a world of possibilities in applications such as industrial automation, automotive electronics, and consumer electronics. With Texas Instruments' reputation for reliability and innovation, you can trust that the TLC5510INSG4 delivers unmatched performance and accuracy. Experience the value and benefits this exceptional converter offers, providing customers with seamless integration and optimal functionality for their projects. Elevate your designs with the TLC5510INSG4 and unlock endless opportunities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 8

Provides sufficient resolution for accurate conversion of analog signals to digital.

Power Supplies (V): 5

Operates on a common and widely available voltage, making it compatible with various systems.

Maximum Operating Temperature: 75 °C

Suitable for a wide range of operating environments without compromising performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Output Format: PARALLEL, 8 BITS

Provides data in parallel format with 8-bit resolution for quick and efficient processing.

Technical Specifications

Analog-to-Digital Converters TLC5510INSG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

75 °C (167 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.591 in (15 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.3

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC5510INSG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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