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TLC549ID

Texas Instruments

TLC549ID by Texas Instruments

TLC549ID by Texas Instruments is an 8-bit ADC with 0.1953% EL, 17us conversion time, and 0.04MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C with a max analog input voltage of 6V. The small outline package makes it suitable for space-constrained designs requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Chip Stock

USA . 9,955 parts In-Stock

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Vyrian

USA . 8,866 parts In-Stock

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Digiode

USA . 4,202 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Rebound Electronics

UK . 75 parts In-Stock

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Pegasus Components GmbH

Germany . 66 parts In-Stock

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Holdelec - ElecDif-Pro

France . 50 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Resion

USA . 38 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 32 parts In-Stock

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Bristol Electronics

USA . 32 parts In-Stock

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Flex Direct, LLC

USA . 6 parts In-Stock

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ABC Electronics Ltd.

UK . 6 parts In-Stock

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One Stop Electronics

USA . 1,076 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 737 parts In-Stock

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$14.287

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Parana Technologies

USA . 2,213 parts In-Stock

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ChromeModa Solutions

Germany . 5,475 parts In-Stock

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$22.012

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IDEA Electronic Components Group

UK . 2,163 parts In-Stock

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Ampacity Inc.

Singapore . 420 parts In-Stock

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Argo Parts USA

USA . 4,373 parts In-Stock

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Continental Prestige Electronics

USA . 4,196 parts In-Stock

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Corphita

USA . 2,312 parts In-Stock

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A-Z Elektronik GmbH

Germany . 785 parts In-Stock

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DigiPath Technology Company

USA . 543 parts In-Stock

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$19.846

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments TLC549ID Analog-to-Digital Converter. Crafted with top-notch quality and expertise, this innovative product offers unmatched performance in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, the TLC549ID delivers exceptional value, accuracy, and speed. Trust Texas Instruments to elevate your projects to new heights with the TLC549ID.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product reliable for long-term use.

No. of Bits: 8

Provides a good resolution for converting analog signals to digital, ensuring accurate data representation.

Maximum Linearity Error (EL): 0.1953 %

Low linearity error ensures accurate conversion of analog signals to digital without distortion.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy-efficient.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC provides fast and accurate conversion, suitable for real-time data acquisition.

Nominal Supply Voltage: 5 V

Operating at a standard voltage, the product is compatible with most systems and easy to integrate.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold circuitry ensures stable and accurate conversion of analog signals, reducing noise and errors.

Technical Specifications

Analog-to-Digital Converters TLC549ID attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC549ID Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-531-2759, 5962015312759

NIIN

015312759

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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