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ADS8688ATDBT

Texas Instruments

ADS8688ATDBT by Texas Instruments

Texas Instruments ADS8688ATDBT is a 16-bit ADC with 8 analog in channels, 0.5 MHz sample rate, and 0.0031% max linearity error. Ideal for military applications due to its small size, low power consumption, and high accuracy.

Median Price

$58.120

Lifecycle Status

Suppliers In-Stock

7

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1k+

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Texas Instruments

USA . 291 parts In-Stock

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$35.649

100+ parts

$31.688

1k+ parts

$23.300

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291

$35.649

$31.688

$23.300

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Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$58.120

100+ parts

$43.550

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200

$58.120

$43.550

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DigiKey

USA . 19 parts In-Stock

1+ parts

$58.120

100+ parts

$42.517

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-

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19

$58.120

$42.517

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Distributors (In-Stock)

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Digiode

USA . 4,116 parts In-Stock

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$33.867

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4,116

$33.867

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Nova Conductors

Japan . 750 parts In-Stock

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$34.950

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750

$34.950

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Vyrian

USA . 6,544 parts In-Stock

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6,544

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VNN

France . 652 parts In-Stock

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652

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Parana Technologies

USA . 147 parts In-Stock

1+ parts

$10.123

100+ parts

-

1k+ parts

$10.669

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147

$10.123

-

$10.669

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AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$11.095

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-

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446

$11.095

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DigiPath Technology Company

USA . 1,479 parts In-Stock

1+ parts

$11.147

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1,479

$11.147

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ChromeModa Solutions

Germany . 6,878 parts In-Stock

1+ parts

$11.374

100+ parts

$9.327

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6,878

$11.374

$9.327

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IDEA Electronic Components Group

UK . 2,296 parts In-Stock

1+ parts

$11.374

100+ parts

$10.805

1k+ parts

$10.237

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2,296

$11.374

$10.805

$10.237

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Corohmni

South Africa . 207 parts In-Stock

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$14.293

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207

$14.293

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.570

100+ parts

$16.691

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$16.691

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1,000

$17.570

$16.691

$16.691

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Ampacity Inc.

Singapore . 318 parts In-Stock

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$30.300

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318

$30.300

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Corphita

USA . 2,181 parts In-Stock

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$32.084

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$32.084

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Continental Prestige Electronics

USA . 5,741 parts In-Stock

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$34.950

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$34.251

5,741

$34.950

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$34.251

Semicontronic

India . 186 parts In-Stock

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$65.950

100+ parts

$64.301

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$63.972

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186

$65.950

$64.301

$63.972

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Argo Parts USA

USA . 1,733 parts In-Stock

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1,733

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iodParts Technologies Inc.

India . 194 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$34.251

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$33.203

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$32.504

50

-

$34.251

$33.203

$32.504

Akira Global LLC

USA . 5 parts In-Stock

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5

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Overview

Experience unparalleled precision and reliability with the ADS8688ATDBT Analog-to-Digital Converter by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards of quality. This 16-bit converter offers 8 analog input channels, making it ideal for a wide range of applications. With its small outline and thin profile package, this device is perfect for space-constrained designs. Trust Texas Instruments to provide innovative solutions that exceed expectations, ensuring optimal performance and accuracy for your projects. Step up your game with the ADS8688ATDBT and unlock endless possibilities in analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making this product suitable for a variety of applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile input options, making this product suitable for multi-channel data acquisition systems.

Surface Mount: YES

Being surface mountable makes installation and integration easier, saving space and making it suitable for compact electronic designs.

No. of Bits: 16

With a 16-bit resolution, this ADC offers high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0031%

The low linearity error indicates high accuracy in data conversion, making this ADC reliable for critical applications.

No. of Terminals: 38

Having 38 terminals provides ample connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package saves space and allows for easy integration into electronic devices with tight constraints.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement makes this ADC energy efficient and suitable for low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions and extended usage.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures the ADC can operate reliably in both extreme cold and hot temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent conductivity and ensures long-term reliability of the connections.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connecting the ADC, enhancing the overall reliability of the system.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim and compact profile, making this ADC suitable for space-constrained applications.

Width: 4.4 mm

The compact width enables easy integration into small electronic devices and PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow temperature and time ensure proper soldering during assembly, reducing the risk of thermal damage to the ADC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure soldering of the ADC during assembly processes.

Length: 9.7 mm

The short length of the ADC contributes to its compact form factor, making it suitable for small electronic applications.

Temperature Grade: MILITARY

Compliant with military-grade standards, this ADC is rugged and reliable, suitable for applications in harsh environmental conditions.

Maximum Analog Input Voltage: 10.24 V

The high maximum analog input voltage range allows for versatile signal compatibility, making this ADC suitable for a wide range of applications.

Sample Rate: 0.5 MHz

With a high sample rate, this ADC can accurately capture fast-changing analog signals, making it suitable for real-time data acquisition applications.

Terminal Form: GULL WING

The gull wing terminal form provides a sturdy and reliable connection, ensuring the longevity and durability of the ADC.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high speed and accuracy in data conversion, making it suitable for precision measurement applications.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making it easier to interface with digital systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on PCBs, enabling space-efficient designs in electronic circuits.

Minimum Analog Input Voltage: -10.24 V

The wide range of minimum analog input voltage accommodates both positive and negative input signals, making this ADC versatile in signal processing applications.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this ADC is capable of withstanding moderate levels of moisture exposure during storage and handling.

Technical Specifications

Analog-to-Digital Converters ADS8688ATDBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

500 kHz

Electrical Specifications

Minimum Analog Input Voltage:

-10.24 V

Maximum Analog Input Voltage:

10.24 V

Minimum Supply Voltage:

1.65 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

38

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Trade Compliance

ADS8688ATDBT Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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