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ADS8688ATDBTR

Texas Instruments

ADS8688ATDBTR by Texas Instruments

The Texas Instruments ADS8688ATDBTR is a 16-bit ADC with 8 analog input channels, 0.0031% max linearity error, and 0.85 us conversion time. Ideal for military applications due to its small size, high sample rate of 0.5 MHz, and binary output format.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,711 parts In-Stock

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Digiode

USA . 2,276 parts In-Stock

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VNN

France . 996 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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One Stop Electronics

USA . 1,625 parts In-Stock

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$3.000

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1,625

$3.000

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Parana Technologies

USA . 1,167 parts In-Stock

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$11.615

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$12.011

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$11.615

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$12.011

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DigiPath Technology Company

USA . 1,958 parts In-Stock

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$12.790

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$11.767

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$12.790

$11.767

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ChromeModa Solutions

Germany . 2,023 parts In-Stock

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$13.051

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$10.702

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$13.051

$10.702

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IDEA Electronic Components Group

UK . 1,033 parts In-Stock

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$13.051

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$12.398

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$11.746

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1,033

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$12.398

$11.746

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AZTECH Wire

Italy . 343 parts In-Stock

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$19.706

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343

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Corohmni

South Africa . 136 parts In-Stock

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$23.992

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$26.268

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$24.955

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$24.955

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$26.268

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Ampacity Inc.

Singapore . 1,052 parts In-Stock

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$33.000

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$33.000

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Semicontronic

India . 293 parts In-Stock

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$34.000

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$33.150

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$32.980

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293

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Continental Prestige Electronics

USA . 3,899 parts In-Stock

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Argo Parts USA

USA . 2,579 parts In-Stock

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Corphita

USA . 2,462 parts In-Stock

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Microchip USA

USA . 1,797 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 210 parts In-Stock

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Overview

Discover the exceptional quality and precision of the ADS8688ATDBTR Analog-to-Digital Converter by Texas Instruments. With a high-performance 16-bit resolution and minimum linearity error, this device offers unparalleled accuracy for your analog signal conversion needs. Perfect for military-grade applications, this compact converter boasts a fast conversion time and low power consumption, making it an ideal choice for demanding environments. Trust Texas Instruments to deliver superior technology that meets your requirements for reliability and efficiency. Elevate your designs with the ADS8688ATDBTR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile signal processing and monitoring capabilities.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving time and effort during production.

No. of Bits: 16

16-bit resolution ensures high accuracy in converting analog signals to digital data, making it suitable for precision measurement applications.

Maximum Linearity Error (EL): 0.0031 %

Low linearity error percentage ensures accurate and reliable conversion of analog signals with minimal distortion.

No. of Terminals: 38

Having enough terminals allows for proper connectivity and signal routing, ensuring efficient signal processing and data transmission.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package design save space on the PCB and reduce overall system footprint while maintaining high performance.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage requirement allows for operation in energy-efficient and low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions without compromising functionality.

Minimum Operating Temperature: -55 °C

Wide temperature range support enables the converter to operate effectively in extreme cold environments, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides superior conductivity, corrosion resistance, and longevity for the terminals, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and facilitates proper alignment during PCB assembly for optimal performance.

Maximum Conversion Time: 0.85 us

Fast conversion time of 0.85 microseconds enables quick and efficient analog-to-digital signal processing.

Maximum Seated Height: 1.2 mm

Low seated height profile of 1.2 mm saves space on the PCB and enables compact design integration.

Width: 4.4 mm

Narrow width dimension of 4.4 mm allows for close component placement on the PCB, saving space and improving overall system density.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering and reflow processes during PCB assembly for reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures proper solder joint formation during PCB assembly for robust mechanical connections.

Length: 9.7 mm

Compact length dimension of 9.7 mm allows for space-efficient placement on the PCB, enabling streamlined system design.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environments with extreme temperature variations, making it ideal for rugged applications.

Maximum Analog Input Voltage: 10.24 V

High maximum analog input voltage tolerance of 10.24 V allows for handling a wide range of input signals without risk of damage, ensuring flexibility in signal processing.

Sample Rate: 0.5 MHz

High sample rate of 0.5 MHz enables quick and precise signal sampling and conversion, ideal for real-time data acquisition and processing.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections during PCB assembly, ensuring robust electrical conductivity and mechanical stability.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation analog-to-digital conversion method offers high precision and efficiency in converting analog signals to digital data, ensuring accurate measurement and analysis.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5 V allows for compatibility with common power sources, simplifying integration into existing systems.

Output Bit Code: BINARY

Binary output bit code format provides straightforward digital data representation for easy processing and analysis.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm enables compact PCB layout design and efficient signal routing for enhanced system performance.

Minimum Analog Input Voltage: -10.24 V

Wide range of minimum analog input voltage tolerance of -10.24 V allows for handling of negative input signals, increasing the versatility of signal processing capabilities.

Output Format: SERIAL

Serial output data format provides efficient data transmission and compatibility with various digital communication protocols, enhancing connectivity options.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold signal processing mechanism allows for accurate and stable analog signal conversion by capturing and maintaining input signal values during conversion.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture during storage and handling, prompting appropriate precautions for product preservation.

Technical Specifications

Analog-to-Digital Converters ADS8688ATDBTR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

850 ns

Electrical Specifications

Minimum Analog Input Voltage:

-10.24 V

Maximum Analog Input Voltage:

10.24 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

38

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Trade Compliance

ADS8688ATDBTR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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