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TLC540IDWR

Texas Instruments

TLC540IDWR by Texas Instruments

TLC540IDWR by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 0.07518 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,865 parts In-Stock

1+ parts

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8,865

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Sensible Micro Corp

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 1,260 parts In-Stock

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1,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$15.620

100+ parts

-

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389

$15.620

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Parana Technologies

USA . 438 parts In-Stock

1+ parts

$17.983

100+ parts

-

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$18.146

10k+ parts

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438

$17.983

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$18.146

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DigiPath Technology Company

USA . 944 parts In-Stock

1+ parts

$19.802

100+ parts

$18.218

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944

$19.802

$18.218

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ChromeModa Solutions

Germany . 4,971 parts In-Stock

1+ parts

$20.206

100+ parts

$16.569

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4,971

$20.206

$16.569

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IDEA Electronic Components Group

UK . 2,236 parts In-Stock

1+ parts

$20.206

100+ parts

$19.196

1k+ parts

$18.185

10k+ parts

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2,236

$20.206

$19.196

$18.185

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One Stop Electronics

USA . 785 parts In-Stock

1+ parts

$23.000

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785

$23.000

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Component Stockers USA

USA . 652 parts In-Stock

1+ parts

$99.990

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652

$99.990

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Corphita

USA . 1,057 parts In-Stock

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1,057

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Microchip USA

USA . 270 parts In-Stock

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270

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Overview

Unlock the power of precise analog-to-digital conversion with Texas Instruments' TLC540IDWR. This high-quality ADC boasts 11 analog input channels and a compact, surface-mount design, making it ideal for a wide range of industrial applications. With superior linearity and fast conversion times, this converter delivers accurate results every time. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and reliability of the TLC540IDWR for yourself.

Feature Benefit Bullets

No. of Analog In Channels: 11

Having 11 analog input channels allows for a wide range of inputs to be converted, making this product versatile and suitable for multiple applications.

No. of Bits: 8

With 8 bits of resolution, this converter provides sufficient accuracy for many industrial and electronic applications.

Maximum Linearity Error (EL): 0.1953%

The low linearity error ensures accurate conversion of analog signals to digital values, making this product reliable for precise measurements.

Maximum Conversion Time: 9 us

The fast conversion time of 9 microseconds allows for real-time data acquisition and processing, making this product suitable for time-sensitive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance and efficiency of the product.

Technical Specifications

Analog-to-Digital Converters TLC540IDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

75.18 kHz

Hold Mode:

Sample

Maximum Conversion Time:

9 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC540IDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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