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TLC533AMN3

Texas Instruments

TLC533AMN3 by Texas Instruments

TLC533AMN3 by Texas Instruments is an 8-bit A/D converter with a supply voltage of 5V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. The package style is in-line with 28 terminals and a terminal pitch of 2.54mm, ideal for various analog-to-digital conversion needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,927 parts In-Stock

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5,927

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Digiode

USA . 1,017 parts In-Stock

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1,017

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$5.082

100+ parts

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838

$5.082

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Parana Technologies

USA . 62 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

$10.817

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62

$10.288

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$10.817

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DigiPath Technology Company

USA . 1,513 parts In-Stock

1+ parts

$11.328

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1,513

$11.328

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ChromeModa Solutions

Germany . 5,510 parts In-Stock

1+ parts

$11.559

100+ parts

$9.478

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5,510

$11.559

$9.478

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IDEA Electronic Components Group

UK . 535 parts In-Stock

1+ parts

$11.559

100+ parts

$10.981

1k+ parts

$10.403

10k+ parts

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535

$11.559

$10.981

$10.403

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One Stop Electronics

USA . 215 parts In-Stock

1+ parts

$36.000

100+ parts

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215

$36.000

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Corphita

USA . 4,883 parts In-Stock

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4,883

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Overview

Unlock the power of precision with the TLC533AMN3 Analog-to-Digital Converter by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch products that exceed expectations. The TLC533AMN3 is perfect for a wide range of applications, offering seamless conversion with 8 bits of accuracy. With a package style designed for easy integration and high-grade materials ensuring durability, this converter is a must-have for any project requiring precise data acquisition. Experience the value and benefits of Texas Instruments' TLC533AMN3 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

No. of Bits: 8

An 8-bit resolution provides sufficient accuracy for many applications while keeping the cost and complexity of the system low.

Power Supplies (V): 5

Operating at a standard 5V power supply makes integration into existing systems easier and more cost-effective.

No. of Terminals: 28

With a higher number of terminals, the product offers more flexibility for interfacing with other components within a system.

Maximum Operating Temperature: 125 °C

The product can withstand high temperatures, making it suitable for operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, making the product suitable for applications where vibration or mechanical stress may be a concern.

Technical Specifications

Analog-to-Digital Converters TLC533AMN3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Electrical Specifications

Power Supplies:

5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Trade Compliance

TLC533AMN3 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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