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TLC533AIFN

Texas Instruments

TLC533AIFN by Texas Instruments

TLC533AIFN by Texas Instruments is an 8-bit ADC with 0.195% EL, 5V supply, and 0.06667 MHz sample rate. Ideal for industrial applications, it features a CMOS technology, BINARY output code, and operates b/w -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,510 parts In-Stock

1+ parts

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8,510

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Digiode

USA . 2,320 parts In-Stock

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2,320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$5.477

100+ parts

-

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405

$5.477

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

$7.629

100+ parts

-

1k+ parts

$8.146

10k+ parts

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719

$7.629

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$8.146

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DigiPath Technology Company

USA . 354 parts In-Stock

1+ parts

$8.401

100+ parts

$7.729

1k+ parts

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354

$8.401

$7.729

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ChromeModa Solutions

Germany . 637 parts In-Stock

1+ parts

$8.572

100+ parts

$7.029

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637

$8.572

$7.029

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IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$8.572

100+ parts

$8.143

1k+ parts

$7.715

10k+ parts

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237

$8.572

$8.143

$7.715

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One Stop Electronics

USA . 1,107 parts In-Stock

1+ parts

$32.000

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1,107

$32.000

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Corphita

USA . 4,402 parts In-Stock

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4,402

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Overview

Enhance your electronic designs with the high-quality TLC533AIFN Analog-to-Digital Converter by Texas Instruments. This versatile chip delivers precise conversion accuracy, making it ideal for a wide range of applications in industrial settings. With its innovative technology and reliable performance, this ADC ensures optimal results while operating at a nominal 5V supply voltage. Trust Texas Instruments to provide you with cutting-edge solutions that add value and efficiency to your projects. Choose the TLC533AIFN for unmatched quality and performance in your next design endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes this product lightweight and durable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits resolution, this ADC provides high accuracy and precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.195%

The low linearity error ensures accurate conversion of analog signals with minimal distortion, making it suitable for precise measurements and applications.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can reliably function in various industrial environments without overheating.

Technology: CMOS

The CMOS technology used in this ADC ensures low power consumption and high speed performance, making it energy-efficient and responsive.

Output Format: PARALLEL, 8 BITS

The parallel output format with 8 bits provides fast and direct access to digital data, making it suitable for real-time processing applications.

Technical Specifications

Analog-to-Digital Converters TLC533AIFN attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.195 %

Sample Rate:

66.67 kHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-300 mV

Maximum Analog Input Voltage:

6.8 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

2 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.453 in (11.5062 mm)

Length:

0.453 in (11.5062 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TLC533AIFN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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