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ADS7953SBDBTRG4

Texas Instruments

ADS7953SBDBTRG4 by Texas Instruments

Texas Instruments' ADS7953SBDBTRG4 is a 12-bit ADC with 16 analog in channels, operating at a sample rate of 1 MHz. Ideal for automotive applications, it offers a max linearity error of 0.0244%, operates at temperatures ranging from -40 to 125 °C, and has a small outline package style.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 8,750 parts In-Stock

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Digiode

USA . 2,499 parts In-Stock

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VNN

France . 811 parts In-Stock

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Component Sense

UK . 418 parts In-Stock

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Nova Conductors

Japan . 23 parts In-Stock

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Ampacity Inc.

Singapore . 826 parts In-Stock

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$7.000

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826

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AZTECH Wire

Italy . 490 parts In-Stock

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$8.564

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Corohmni

South Africa . 7 parts In-Stock

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$13.097

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One Stop Electronics

USA . 1,070 parts In-Stock

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$20.000

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Parana Technologies

USA . 672 parts In-Stock

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$23.759

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$24.389

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ChromeModa Solutions

Germany . 6,127 parts In-Stock

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$26.695

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$21.890

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IDEA Electronic Components Group

UK . 1,376 parts In-Stock

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$25.360

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$24.026

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Semicontronic

India . 518 parts In-Stock

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Argo Parts USA

USA . 4,642 parts In-Stock

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Kepictronics

USA . 3,250 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,178 parts In-Stock

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Continental Prestige Electronics

USA . 453 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Modulus Dynamics

Lithuania . 35 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADS7953SBDBTRG4 Analog-to-Digital Converter. Crafted with high-quality materials and cutting-edge technology, this converter boasts 16 analog input channels and a compact design for seamless integration. Ideal for automotive applications, this ADC delivers rapid conversion times and superior performance, ensuring accurate results every time. Trust Texas Instruments to elevate your projects with the ADS7953SBDBTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the analog-to-digital converter, ensuring a long lifespan.

No. of Analog In Channels: 16

Having 16 analog input channels allows for versatile input options, making it suitable for applications requiring multiple input signals.

Surface Mount: YES

Surface mount compatibility makes installation and integration easier and more efficient.

No. of Bits: 12

With 12 bits of resolution, this converter offers a high level of accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures that the converted digital values closely match the original analog signals.

Power Supplies (V): 1.8/5,3/5

The flexibility in power supply options allows for compatibility with various voltage requirements in different applications.

No. of Terminals: 38

Having 38 terminals provides ample connectivity options for input and output signals, enhancing the versatility of the converter.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and lightweight package style makes this converter suitable for space-constrained applications without compromising on performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable operation even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and ensure secure connections.

Maximum Conversion Time: 0.8 us

The fast conversion time enables quick processing of input signals, making this converter suitable for real-time applications.

Maximum Seated Height: 1.2 mm

The low seated height makes this converter suitable for compact designs and applications with limited vertical space.

Width: 4.4 mm

The small width allows for efficient placement on circuit boards and space-saving designs.

Maximum Time At Peak Reflow Temperature (s): 30

This spec indicates the reflow soldering time, ensuring proper soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and assembly compatibility.

Length: 9.7 mm

The compact length of the converter contributes to its overall small footprint and space-saving design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this converter is suitable for use in automotive applications, where temperature fluctuations are common.

Maximum Analog Input Voltage: 5.02 V

The high maximum analog input voltage tolerance allows for accurate conversion of a wide range of input signals.

Sample Rate: 1 MHz

The high sample rate enables fast and efficient conversion of input signals, making this converter suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides easy solderability and secure mechanical connections during installation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation type of converter offers high speed and accuracy in converting analog signals to digital values.

Nominal Supply Voltage: 3.3 V

A standard nominal supply voltage of 3.3V makes this converter compatible with common power sources in many applications.

Output Bit Code: BINARY

The binary output bit code provides clear and easily interpretable digital data for further processing.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for close integration on circuit boards and compact designs.

Minimum Analog Input Voltage: 0 V

The low minimum analog input voltage tolerance ensures accurate conversion of even small signal values.

Output Format: SERIAL

The serial output format offers efficient data transmission and compatibility with a wide range of communication protocols.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold functionality allows for accurate sampling of input signals at high speeds, ensuring precise conversion.

Moisture Sensitivity Level (MSL): 2

The low moisture sensitivity level indicates high reliability in humid environments and during assembly processes.

Technical Specifications

Analog-to-Digital Converters ADS7953SBDBTRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

16

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

800 ns

Electrical Specifications

Power Supplies:

1.8/5,3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.02 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

38

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP38,.25,20

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G38

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7953SBDBTRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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