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ADS7830IPWRG4

Texas Instruments

ADS7830IPWRG4 by Texas Instruments

ADS7830IPWRG4 by Texas Instruments is an 8-bit ADC with 8 analog in channels, 0.1953% max linearity error, and 2.7/5V power supplies. Ideal for industrial applications, it features a CMOS technology, 0.07 MHz sample rate, and serial output format for precise data conversion in compact designs.

Median Price

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Lifecycle Status

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9

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1k+

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Chip Stock

USA . 17,460 parts In-Stock

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Sensible Micro Corp

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Digiode

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Sea View Technologies

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Bristol Electronics

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Nova Conductors

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NexGen Digital

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AZTECH Wire

Italy . 755 parts In-Stock

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$6.078

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Parana Technologies

USA . 2,325 parts In-Stock

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$10.990

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$11.451

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Corohmni

South Africa . 226 parts In-Stock

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DigiPath Technology Company

USA . 2,298 parts In-Stock

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ChromeModa Solutions

Germany . 5,108 parts In-Stock

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

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Advanced Electronics

New Zealand . 26 parts In-Stock

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Semicontronic

India . 669 parts In-Stock

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One Stop Electronics

USA . 431 parts In-Stock

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Microchip USA

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Argo Parts USA

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Lucentia Tech

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Modulus Dynamics

Lithuania . 96 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADS7830IPWRG4 Analog-to-Digital Converter. Crafted with top-quality materials and cutting-edge technology, this converter offers 8 analog input channels and a maximum linearity error of just 0.1953%. Ideal for a wide range of industrial applications, this converter provides fast and accurate conversion with a sample rate of 0.07 MHz. Trust in Texas Instruments to deliver superior performance and value with the ADS7830IPWRG4. Upgrade your systems today and elevate your operations to new heights of efficiency and accuracy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the converter.

No. of Analog In Channels: 8

Allows for the conversion of up to 8 analog signals simultaneously, increasing efficiency.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying the assembly process.

Maximum Linearity Error (EL): 0.1953%

High precision and accuracy in converting analog signals to digital, ensuring reliable data acquisition.

Power Supplies (V): 2.7/5

Versatile operating voltage range for compatibility with a variety of systems.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide temperature range for operation.

Sample Rate: 0.07 MHz

Fast sampling rate for quick and accurate conversion of analog signals.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes the successive approximation method for precise conversion of analog signals to digital.

Technical Specifications

Analog-to-Digital Converters ADS7830IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

70 kHz

Hold Mode:

Sample

Maximum Conversion Time:

5 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7830IPWRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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