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TISP6NTP2ADR

Texas Instruments

TISP6NTP2ADR by Texas Instruments

TISP6NTP2ADR by Texas Instruments is a Telecom IC with surge protection circuit. It has 2 functions, operates b/w -40 to 85°C, and comes in a small outline package. Ideal for telecom applications requiring protection against surges.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10,000 parts In-Stock

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Vyrian

USA . 2,901 parts In-Stock

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PC Components Company LLC

USA . 2,103 parts In-Stock

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Bristol Electronics

USA . 2,103 parts In-Stock

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Digiode

USA . 1,353 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 983 parts In-Stock

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Prism Electronics

USA . 50 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 236 parts In-Stock

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$10.024

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$10.583

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236

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AZTECH Wire

Italy . 386 parts In-Stock

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$10.274

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IDEA Electronic Components Group

UK . 1,247 parts In-Stock

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$11.263

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$10.700

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$10.137

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ChromeModa Solutions

Germany . 574 parts In-Stock

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$11.263

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$9.236

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One Stop Electronics

USA . 191 parts In-Stock

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$225.000

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Corphita

USA . 3,481 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Assy Fe

Spain . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,411 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

USA . 2,057 parts In-Stock

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$10.155

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Cyclops Electronics Ltd (Excess)

UK . 983 parts In-Stock

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Overview

Safeguard your telecom equipment with the TISP6NTP2ADR by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers top-notch protection ICs for telecom applications. This surge protection circuit offers peace of mind by safeguarding your devices against damaging voltage spikes. Its small outline package makes it easy to integrate into your designs, while its industrial temperature grade ensures reliable performance in harsh environments. Trust Texas Instruments to provide the protection your telecom equipment needs to keep running smoothly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mount allows for easier installation onto the PCB, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single IC minimizes the need for additional components, reducing overall cost and complexity.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to place and solder onto the PCB, contributing to efficient assembly.

No. of Terminals: 8

Having multiple terminals allows for versatile connection options, increasing the flexibility of the IC within the circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact telecom devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the IC to function in a wide range of temperature environments, increasing its versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, facilitating reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connecting the IC to the circuit, enhancing reliability.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact and slim design, suitable for space-constrained telecom applications.

Width: 3.905 mm

The narrow width of the IC contributes to efficient space utilization on the PCB, making it ideal for compact telecom devices.

Length: 4.9 mm

The compact length of the IC ensures a small footprint on the PCB, enabling it to be used in space-saving telecom equipment.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh operating conditions commonly found in industrial telecom applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, enhancing the overall reliability of the connection.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes, ensuring reliable operation and protection of sensitive components.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, the IC can be easily mounted on the PCB using standard manufacturing processes, simplifying assembly.

Technical Specifications

Telecom - Protection ICs TISP6NTP2ADR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.905 mm

Trade Compliance

TISP6NTP2ADR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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