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TIC106D

Texas Instruments

TIC106D by Texas Instruments

TIC106D by Texas Instruments is a SCR with 400V repetitive peak reverse voltage, 30A non-repetitive peak on-state current, and 0.2mA max DC gate trigger current. It is used in applications requiring high power control such as motor drives and lighting systems.

Median Price

$2.442

Lifecycle Status

Suppliers In-Stock

26

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1k+

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TEDSS.com

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Digiode

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Vyrian

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Ace Electronics

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American Microsemiconductor Inc.

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Holdelec - ElecDif-Pro

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LIBRA Elektronik GmbH

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Pegasus Components GmbH

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Electronic Expediters

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Corel Iberica Componentes, S.L.

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Halfin

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Bristol Electronics

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GES GmbH

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LittleDiode

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PC Components Company LLC

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Digital Electronic Gebert Verwaltungs UG

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ECAB

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Classic Components Corporation

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Fibra_Brandt Electronic GMBH

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Euro-Tech

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Atlantic Semiconductor

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ACDS - Activité Composants Distribution Service

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Sinequanon

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ICP Electronique

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Goldney Electronics S.L.

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Corphita

USA . 4,965 parts In-Stock

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Parana Technologies

USA . 1,463 parts In-Stock

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$3.153

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$3.672

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DigiPath Technology Company

USA . 895 parts In-Stock

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$3.472

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$3.194

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ChromeModa Solutions

Germany . 6,867 parts In-Stock

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IDEA Electronic Components Group

UK . 786 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Perfect Parts

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Computer Components Inc. - USA

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Overview

Unlock the power of innovation with the TIC106D by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Silicon Controlled Rectifiers (SCR) like the TIC106D. This product is designed for reliability and efficiency, offering a maximum On-state current of 5A and a Repetitive Peak Reverse Voltage of 400V. Perfect for a wide range of applications, the TIC106D provides unmatched value with its high performance and durability. Experience the benefits of this cutting-edge technology and take your projects to the next level with the TIC106D SCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components, ensuring durability and longevity of the product.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current allows for precise control and reliable operation of the SCR.

Configuration: SINGLE

Simplified design and wiring with a single configuration.

Non Repetitive Peak On-state Current: 30 A

Capable of handling high peak currents for demanding applications.

Package Shape: RECTANGULAR

Easy to mount and integrate into existing systems due to standard shape.

Terminal Form: THROUGH-HOLE

Easy to solder and secure onto circuit boards.

Maximum On-state Current: 5 A

Sufficient current rating for various small to medium power applications.

Maximum Leakage Current: 1 mA

Low leakage current for efficient operation and minimal power loss.

Repetitive Peak Reverse Voltage: 400 V

Suitable for applications requiring high reverse voltage capabilities.

No. of Terminals: 3

Simple and straightforward connection with three terminals.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for stable installation in various environments.

Maximum Operating Temperature: 155 °C

Wide operating temperature range allows for reliable performance in different conditions.

Trigger Device Type: SCR

SCR technology provides robust and reliable switching for power control applications.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures without sacrificing performance.

Terminal Position: SINGLE

Simplified wiring and installation with a single terminal position.

Maximum RMS On-state Current: 5 A

Handles RMS current efficiently for continuous operation.

Maximum DC Gate Trigger Voltage: 1 V

Low gate trigger voltage for precise control and reliable switching.

Case Connection: ANODE

Specific case connection for easy integration into circuits.

Repetitive Peak Off-state Voltage: 400 V

Meets the requirements for high off-state voltage applications.

Maximum Holding Current: 5 mA

Capable of maintaining current flow without gate triggering for certain applications.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TIC106D attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Texas Instruments

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

1 mA

Non Repetitive Peak On-state Current:

30 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

5 A

Maximum Operating Temperature:

155 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

5 A

Repetitive Peak Off-state Voltage:

400 V

Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

TIC106D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

NSN

5961-01-392-4840, 5961013924840, 5961-21-891-8028, 5961218918028

NIIN

013924840, 218918028

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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