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TIBPAL16L8-30MFKB

Texas Instruments

TIBPAL16L8-30MFKB by Texas Instruments

TIBPAL16L8-30MFKB by Texas Instruments is a 5V TTL PLD with 30ns propagation delay, ideal for MILITARY applications. Featuring 16 inputs and 8 outputs, it offers combinatorial output function and operates at up to 25MHz clock frequency. The chip carrier package style with ceramic body makes it suitable for high-temp environments.

Median Price

$87.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 6 parts In-Stock

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Digiode

USA . 2,105 parts In-Stock

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$82.840

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Vyrian

USA . 2,568 parts In-Stock

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Resion

USA . 10 parts In-Stock

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IBS Electronics

USA . 6 parts In-Stock

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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AZTECH Wire

Italy . 1,022 parts In-Stock

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$15.710

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Parana Technologies

USA . 2,213 parts In-Stock

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DigiPath Technology Company

USA . 1,037 parts In-Stock

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$67.413

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$62.020

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

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$68.789

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$65.350

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$61.910

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ChromeModa Solutions

Germany . 118 parts In-Stock

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Corphita

USA . 2,891 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Overview

Unlock the power of programmable logic with the TIBPAL16L8-30MFKB by Texas Instruments. Designed with precision and reliability in mind, this PAL-type device offers lightning-fast 30 ns propagation delay and a wide operating temperature range from -55 to 125°C. Perfect for military-grade applications, this chip carrier package boasts 64 product terms and 10 dedicated inputs, providing unparalleled flexibility and performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability, making the product suitable for harsh environments or applications where high performance is required.

Propagation Delay: 30 ns

The low propagation delay ensures fast processing and response times, making the product efficient in time-critical applications.

Maximum Supply Voltage: 5.5 V

The higher supply voltage tolerance allows for flexibility and compatibility with various power sources, increasing the product's versatility.

Technology Used: TTL

TTL technology is known for its robustness and reliability, ensuring stable performance of the product in demanding conditions.

No. of Inputs: 16

With a higher number of inputs, the product can accommodate a larger amount of data or information, enhancing its capacity and capabilities.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-30MFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16L8-30MFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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