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PAL16R4AMFKB

Texas Instruments

PAL16R4AMFKB by Texas Instruments

PAL16R4AMFKB by Texas Instruments is a TTL-based PLD with 30 ns propagation delay, 64 product terms, and 25 MHz clock frequency. Ideal for military applications due to its MIL-graded temperature range, it features 8 dedicated inputs and 4 I/O lines in a square chip carrier package.

Median Price

$59.040

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$52.480

1k+ parts

$46.950

10k+ parts

$44.190

40

-

$52.480

$46.950

$44.190

DigiKey

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Verical

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$65.600

1k+ parts

$58.688

10k+ parts

$55.237

40

-

$65.600

$58.688

$55.237

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 10 parts In-Stock

1+ parts

$39.500

100+ parts

-

1k+ parts

-

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10

$39.500

-

-

-

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$46.060

100+ parts

-

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-

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43

$46.060

-

-

-

Digiode

USA . 1,481 parts In-Stock

1+ parts

$48.165

100+ parts

-

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-

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1,481

$48.165

-

-

-

Vyrian

USA . 8,446 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

8,446

-

-

-

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Elcom Components

USA . 46 parts In-Stock

1+ parts

-

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46

-

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Mil-Aero Solutions, Inc.

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

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23

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Electronics Depot

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$15.378

100+ parts

-

1k+ parts

-

10k+ parts

-

564

$15.378

-

-

-

Parana Technologies

USA . 879 parts In-Stock

1+ parts

$21.059

100+ parts

-

1k+ parts

$21.304

10k+ parts

-

879

$21.059

-

$21.304

-

DigiPath Technology Company

USA . 1,968 parts In-Stock

1+ parts

$23.189

100+ parts

$21.334

1k+ parts

-

10k+ parts

-

1,968

$23.189

$21.334

-

-

ChromeModa Solutions

Germany . 2,705 parts In-Stock

1+ parts

$23.662

100+ parts

$19.403

1k+ parts

-

10k+ parts

-

2,705

$23.662

$19.403

-

-

IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$23.662

100+ parts

$22.479

1k+ parts

$21.296

10k+ parts

-

2,266

$23.662

$22.479

$21.296

-

Ampacity Inc.

Singapore . 40 parts In-Stock

1+ parts

$43.090

100+ parts

-

1k+ parts

-

10k+ parts

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40

$43.090

-

-

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Vigor

Singapore . 480 parts In-Stock

1+ parts

$43.870

100+ parts

-

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480

$43.870

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$45.139

100+ parts

-

1k+ parts

$43.333

10k+ parts

-

500

$45.139

-

$43.333

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Corphita

USA . 3,971 parts In-Stock

1+ parts

$45.630

100+ parts

-

1k+ parts

-

10k+ parts

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3,971

$45.630

-

-

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Microchip USA

USA . 1,722 parts In-Stock

1+ parts

$105.940

100+ parts

$104.100

1k+ parts

$103.170

10k+ parts

$102.250

1,722

$105.940

$104.100

$103.170

$102.250

Argo Parts USA

USA . 3,328 parts In-Stock

1+ parts

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3,328

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Continental Prestige Electronics

USA . 1,700 parts In-Stock

1+ parts

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1,700

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Overview

Unleash the power of cutting-edge technology with the PAL16R4AMFKB by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device offers unparalleled performance and reliability for a wide range of applications. From aerospace to telecommunications, this versatile PLD is designed to meet the demands of even the most complex projects. Experience seamless functionality and optimal efficiency with Texas Instruments' innovative solutions. Elevate your projects to new heights with the PAL16R4AMFKB.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials enhances durability and reliability of the product.

Propagation Delay: 30 ns

With a fast propagation delay of 30 ns, this PLD ensures efficient signal processing.

Surface Mount: YES

The surface mount capability makes this PLD easy to install and reduces overall PCB footprint.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power supply options.

Screening Level: 38535Q/M;38534H;883B

This PLD meets stringent screening levels for quality and reliability in demanding applications.

Technology Used: TTL

By using TTL technology, this PLD offers good noise immunity and compatibility with TTL logic levels.

No. of Inputs: 12

With 12 inputs, this PLD can accommodate a variety of input signals for versatile operation.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on the PCB.

Form Of Terminal: NO LEAD

The no-lead terminal design simplifies soldering and reduces potential for solder bridges.

Architecture: PAL-TYPE

The PAL-type architecture offers flexibility in programming and customization of logic functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources.

Packing Method: TUBE

The tube packing method provides safe and convenient transportation and storage of the PLD.

Power Supplies (V): 5

Operating at 5 V for power supplies, this PLD can easily integrate into existing systems.

No. of Terminals: 20

With 20 terminals, this PLD offers ample connectivity options for interfacing with other components.

Programmable IC Type: OT PLD

Being an OTP PLD, this device allows for one-time programming for customized logic functions.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and ease of handling during assembly.

Output Function: MIXED

With mixed output functions, this PLD can handle various types of output signals simultaneously.

No. of Product Terms: 64

The 64 product terms provide flexibility in defining logic equations for enhanced functionality.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this PLD can withstand harsh environmental conditions.

Pitch Of Terminal: 1.27 mm

The 1.27 mm pitch of terminals allows for easy routing and connection on the PCB.

Organization: 8 DEDICATED INPUTS, 4 I/O

The dedicated inputs and I/O configuration provide clear signal routing and logic organization.

No. of Dedicated Inputs: 8

The presence of 8 dedicated inputs ensures efficient handling of specific input signals.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this PLD can operate reliably in extreme cold conditions.

Finishing Of Terminal Used: TIN LEAD

The tin-lead finishing of terminals ensures good solderability and long-term reliability.

Position Of Terminal: QUAD

The quad position of terminals simplifies PCB layout and connection arrangements.

Maximum Seated Height: 2.03 mm

The low maximum seated height of 2.03 mm allows for compact and slim device designs.

Width: 8.89 mm

With a width of 8.89 mm, this PLD offers a balanced size for easy integration in various applications.

Maximum Clock Frequency: 25 MHz

The maximum clock frequency of 25 MHz enables rapid signal processing and high-speed operations.

No. of Outputs: 8

With 8 outputs, this PLD can drive multiple external devices or logic gates simultaneously.

Length: 8.89 mm

The length of 8.89 mm provides a compact form factor for space-constrained applications.

No. of I/O Lines: 4

The 4 I/O lines offer a balanced number of input and output signals for versatile connectivity.

Grading Of Temperature: MILITARY

Rated for military-grade temperature ranges, this PLD is suitable for rugged and high-reliability applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16R4AMFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL16R4AMFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-264-3009, 5962012643009

NIIN

012643009

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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