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PAL16L8A-2MFKB

Texas Instruments

PAL16L8A-2MFKB by Texas Instruments

PAL16L8A-2MFKB by Texas Instruments is a TTL technology-based PLD with 16 inputs, 8 outputs, and 64 product terms. It has a propagation delay of 40 ns and operates at a max clock frequency of 16 MHz. Ideal for military applications due to its MILITARY grading and wide temperature range from -55°C to 125°C.

Median Price

$51.187

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip1Stop

Japan . 8 parts In-Stock

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$51.187

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Freelance Electronics

USA . 27 parts In-Stock

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$29.987

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$31.487

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$29.688

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Digiode

USA . 494 parts In-Stock

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$48.628

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Vyrian

USA . 2,126 parts In-Stock

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Astute Electronics Inc

. 11 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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AZTECH Wire

Italy . 37 parts In-Stock

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$14.450

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Corphita

USA . 4,184 parts In-Stock

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$46.068

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Parana Technologies

USA . 717 parts In-Stock

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$137.428

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DigiPath Technology Company

USA . 965 parts In-Stock

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$151.326

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$139.220

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ChromeModa Solutions

Germany . 6,414 parts In-Stock

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$154.414

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$126.619

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IDEA Electronic Components Group

UK . 665 parts In-Stock

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$154.414

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$146.693

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$138.973

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665

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Microchip USA

USA . 2,766 parts In-Stock

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Overview

Discover the PAL16L8A-2MFKB by Texas Instruments, a top-quality Programmable Logic Device that offers unparalleled reliability and performance. As a renowned manufacturer in the industry, Texas Instruments ensures superior quality and cutting-edge technology in their products. Perfect for a wide range of applications, this PLD provides fast propagation delay and seamless integration with a maximum supply voltage of 5.5V. With 64 product terms and 8 outputs, the PAL16L8A-2MFKB delivers unmatched value and benefits to customers seeking efficient and reliable programmable IC solutions. Choose Texas Instruments for unbeatable quality and performance in every application.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material ensures durability and reliability, making this product suitable for harsh environments.

Propagation Delay: 40 ns

With a low propagation delay of 40 ns, this PLD offers fast processing times, making it efficient for time-sensitive applications.

Technology Used: TTL

The use of TTL technology provides compatibility with existing systems and offers reliable signal transmission.

No. of Inputs: 16

The 16 input capability allows for versatile programming options and increased functionality in circuit designs.

Output Function: COMBINATORIAL

The combinatorial output function enables the device to perform complex logic operations, making it suitable for a wide range of applications.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this PLD can handle high-speed operations and demanding applications.

Grading Of Temperature: MILITARY

The military-grade temperature rating ensures that this PLD can withstand extreme conditions, making it ideal for mission-critical systems.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2MFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

16 MHz

Propagation Delay:

40 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL16L8A-2MFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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