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PAL16L8A-2CFN

Texas Instruments

PAL16L8A-2CFN by Texas Instruments

PAL16L8A-2CFN by Texas Instruments is a TTL technology-based PLD with 35 ns propagation delay. It features 16 inputs, 8 outputs, and 64 product terms for combinatorial output functions. Ideal for commercial applications requiring fast logic processing in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,572 parts In-Stock

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4,572

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Digiode

USA . 3,820 parts In-Stock

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3,820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$15.907

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672

$15.907

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One Stop Electronics

USA . 1,487 parts In-Stock

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$33.000

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1,487

$33.000

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Parana Technologies

USA . 89 parts In-Stock

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$131.580

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89

$131.580

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DigiPath Technology Company

USA . 1,581 parts In-Stock

1+ parts

$144.886

100+ parts

$133.295

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1,581

$144.886

$133.295

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ChromeModa Solutions

Germany . 4,764 parts In-Stock

1+ parts

$147.843

100+ parts

$121.231

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4,764

$147.843

$121.231

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$147.843

100+ parts

$140.451

1k+ parts

$133.059

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2,100

$147.843

$140.451

$133.059

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Corphita

USA . 2,386 parts In-Stock

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2,386

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Overview

Unlock the potential of your electronic projects with the PAL16L8A-2CFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you high-quality Programmable Logic Devices that offer unmatched reliability and performance. Whether you're designing consumer electronics, industrial automation systems, or telecommunications equipment, this versatile PLD is the perfect solution for your application needs. With fast propagation delay and a wide range of product terms, the PAL16L8A-2CFN delivers exceptional value and flexibility to help you bring your designs to life. Choose Texas Instruments for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC

PLASTIC material makes the package lightweight and durable, ideal for portable electronic devices.

Propagation Delay: 35 ns

Low propagation delay of 35 ns ensures fast signal processing, making this PLD suitable for high-speed applications.

Surface Mount: SURFACE MOUNT

Surface mount technology allows for easy mounting on circuit boards, saving space and making assembly more efficient.

Technology Used: TTL

TTL technology ensures reliable and compatible operation with other TTL-based components.

No. of Inputs: 16

With 16 inputs, this PLD can handle multiple input signals, providing flexibility for complex logic operations.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V, this PLD is compatible with standard power sources.

No. of Outputs: 8

Having 8 outputs allows for multiple output signals to be generated simultaneously, increasing functionality.

Programmable IC Type: OT PLD

Being an OTP PLD (One-Time Programmable), this device offers non-volatile programming, ensuring the logic configuration is retained even when powered off.

No. of Product Terms: 64

With 64 product terms, this PLD can support complex logic functions, making it versatile for various application needs.

Output Function: COMBINATORIAL

Combinatorial output function allows for the generation of output signals based on combinations of input signals, offering flexibility in logic operations.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

35 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J20

Qualified:

No

Trade Compliance

PAL16L8A-2CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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