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PAL16L8A-2MFK

Texas Instruments

PAL16L8A-2MFK by Texas Instruments

PAL16L8A-2MFK by Texas Instruments is a TTL technology PLD with 40 ns propagation delay, 16 inputs, and 64 product terms. It is used in military applications for combinatorial output functions with 10 dedicated inputs and 6 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,332 parts In-Stock

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Digiode

USA . 1,905 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 472 parts In-Stock

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$14.407

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One Stop Electronics

USA . 1,187 parts In-Stock

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$22.000

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Parana Technologies

USA . 1,740 parts In-Stock

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$66.466

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DigiPath Technology Company

USA . 2,359 parts In-Stock

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$73.187

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$67.332

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2,359

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ChromeModa Solutions

Germany . 5,144 parts In-Stock

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$74.681

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$61.238

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

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$74.681

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$70.947

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$67.213

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Corphita

USA . 4,456 parts In-Stock

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Overview

Unlock the power of advanced technology with the PAL16L8A-2MFK by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Programmable Logic Devices that are essential for a wide range of applications. With its superior performance and reliability, this PLD offers unmatched value to customers looking for efficient and precise solutions. Whether you're designing consumer electronics, industrial automation systems, or telecommunications equipment, the PAL16L8A-2MFK is the perfect choice to drive innovation and success in your projects. Trust Texas Instruments to provide the cutting-edge technology you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh operating environments.

Propagation Delay: 40 ns

The low propagation delay allows for fast signal processing, making the product efficient in time-critical applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and allowing for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of input voltages, increasing flexibility in usage.

Technology Used: TTL

TTL technology provides high-speed operation and low power consumption, making the product suitable for applications requiring fast and efficient processing.

No. of Inputs: 16

Having a large number of inputs allows for versatile connectivity and input options in complex logic circuits.

Package Shape: SQUARE

The square package shape enables easy alignment and mounting on circuit boards, ensuring proper orientation during installation.

Form Of Terminal: NO LEAD

The no lead terminal design reduces the risk of short circuits and improves signal reliability in the product.

Architecture: PAL-TYPE

PAL-type architecture offers programmable logic capabilities, allowing for customized logic functions and configurations to meet specific application requirements.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making the product widely usable across different electronic systems.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures stable performance and reliable operation of the product.

No. of Terminals: 20

Having multiple terminals provides ample connectivity options, facilitating integration with other components and devices in a circuit.

Programmable IC Type: OT PLD

Being a programmable IC type allows for reconfigurability and customization of logic functions, making the product adaptable to changing system requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, ideal for space-constrained applications and high-temperature environments.

Output Function: COMBINATORIAL

Combinatorial output function allows for logical combinations of input signals, providing flexibility and versatility in defining output logic states.

No. of Product Terms: 64

Having 64 product terms allows for complex logic operations and enhanced functionality in creating custom logic circuits.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures operational stability and reliability even under low-power conditions.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, up to 125°C, making the product suitable for industrial and automotive applications where temperature fluctuations are common.

Pitch Of Terminal: 1.27 mm

The terminal pitch of 1.27mm allows for easy connections and soldering, making the product user-friendly during installation and maintenance.

Organization: 10 DEDICATED INPUTS, 6 I/O

Organized with dedicated inputs and I/O lines, provides a clear and structured layout for designing and implementing logic functions effectively.

No. of Dedicated Inputs: 10

Having 10 dedicated inputs allows for specific signal connections and enhances the product's ability to handle multiple input sources simultaneously.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions down to -55°C, ensuring reliable performance in harsh environments with low temperatures.

Position Of Terminal: QUAD

The quad terminal layout provides a standardized and efficient arrangement for connecting external components, ensuring proper signal flow and connectivity.

Maximum Seated Height: 2.03 mm

With a low maximum seated height of 2.03mm, the product allows for slim and compact PCB designs while maintaining ample space for other components.

Width: 8.89 mm

The width of 8.89mm offers a compact form factor that saves space on circuit boards and enables dense integration of components in limited spaces.

No. of Outputs: 8

Having 8 outputs provides multiple logic states for output signals, enhancing the product's versatility in controlling external devices and circuits.

Length: 8.89 mm

With a length of 8.89mm, the product maintains a square form factor, making it easy to handle and install on standard PCB layouts.

No. of I/O Lines: 6

The presence of 6 I/O lines offers flexible input-output options, allowing for interaction with external devices and components in diverse applications.

Grading Of Temperature: MILITARY

Designed to meet military-grade temperature standards, ensuring reliable performance in rugged environments and critical applications where temperature variations are common.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2MFK attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Propagation Delay:

40 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-N20

Qualified:

No

Trade Compliance

PAL16L8A-2MFK Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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