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PAL16L8A-2MFH

Texas Instruments

PAL16L8A-2MFH by Texas Instruments

PAL16L8A-2MFH by Texas Instruments is a TTL technology-based PLD with 40ns propagation delay. It features 16 inputs, 8 outputs, and 64 product terms in a ceramic chip carrier package. Ideal for military applications due to its wide operating temperature range of -55°C to 125°C and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,738 parts In-Stock

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Digiode

USA . 327 parts In-Stock

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AZTECH Wire

Italy . 678 parts In-Stock

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$9.416

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One Stop Electronics

USA . 310 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,270 parts In-Stock

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$73.505

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DigiPath Technology Company

USA . 2,287 parts In-Stock

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$80.938

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$74.463

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

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$82.590

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$78.460

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$74.331

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2,003

$82.590

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ChromeModa Solutions

Germany . 1,992 parts In-Stock

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$82.590

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$67.724

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Corphita

USA . 505 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the PAL16L8A-2MFH by Texas Instruments, a top-tier manufacturer known for delivering high-quality programmable logic devices (PLD). Perfect for a wide range of applications, this chip carrier device offers lightning-fast 40ns propagation delay and 64 product terms for maximum performance. With its military-grade temperature grading and combinatorial output function, this PAL-type PLD is a game-changer in the industry. Upgrade your projects with the innovative features and reliability of the PAL16L8A-2MFH and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic material used in the package body provides durability and reliability to the PLD, making it suitable for industrial and harsh environments.

Propagation Delay: 40 ns

With a low propagation delay of 40 ns, this PLD offers fast processing speed, making it ideal for applications that require quick response times.

Technology Used: TTL

The use of TTL technology ensures compatibility with other TTL devices and provides reliable performance in digital circuits.

No. of Inputs: 16

With 16 inputs, this PLD can handle a wide range of input signals, increasing its versatility for various applications.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V makes this PLD compatible with standard digital circuits and power sources.

Output Function: COMBINATORIAL

The combinatorial output function allows for logic functions to be implemented without the need for sequential elements, simplifying the design of digital systems.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures that this PLD can operate reliably in extreme temperature conditions, making it suitable for military and aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2MFH attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

40 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-XQCC-N20

Qualified:

No

Trade Compliance

PAL16L8A-2MFH Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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