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PAL16L8A-2CJ

Texas Instruments

PAL16L8A-2CJ by Texas Instruments

PAL16L8A-2CJ by Texas Instruments is a TTL technology-based PLD with 35ns propagation delay. It features 16 inputs, 8 outputs, and 64 product terms. This programmable IC in ceramic package is ideal for combinatorial applications requiring a nominal voltage of 5V.

Median Price

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Lifecycle Status

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7

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1k+

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Vyrian

USA . 6,449 parts In-Stock

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Digiode

USA . 271 parts In-Stock

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LWI Electronics Inc

India . 93 parts In-Stock

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ECAB

Sweden . 55 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 16 parts In-Stock

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Pegasus Components GmbH

Germany . 14 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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AZTECH Wire

Italy . 634 parts In-Stock

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$13.258

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Semicontronic

India . 537 parts In-Stock

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$33.150

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$32.980

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One Stop Electronics

USA . 1,311 parts In-Stock

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$35.000

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Parana Technologies

USA . 915 parts In-Stock

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$46.143

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$4,285.072

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$41.529

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DigiPath Technology Company

USA . 846 parts In-Stock

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$50.809

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$46.744

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ChromeModa Solutions

Germany . 4,603 parts In-Stock

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$51.846

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IDEA Electronic Components Group

UK . 2,054 parts In-Stock

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Corphita

USA . 4,515 parts In-Stock

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ChipstoGo Electronic ltd

UK . 36 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 19 parts In-Stock

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Overview

Enhance your electronic projects with the PAL16L8A-2CJ by Texas Instruments, a top-of-the-line Programmable Logic Device designed to deliver exceptional performance and reliability. Manufactured using high-quality materials and advanced technology, this PLD offers 64 product terms and 8 outputs for versatile applications. Whether you're working on industrial automation or consumer electronics, this PAL-TYPE device provides a seamless solution with a quick propagation delay of 35 ns. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with the PAL16L8A-2CJ.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent heat dissipation and durability, making this PLD suitable for harsh environments.

Propagation Delay: 35 ns

Low propagation delay ensures quick response times, making it ideal for applications requiring fast processing.

Technology Used: TTL

TTL technology offers high-speed digital circuits, enhancing the overall performance of the PLD.

No. of Inputs: 16

Having 16 inputs allows for versatile input configurations, making it suitable for complex logic operations.

Nominal Supply Voltage (V): 5

Operating at 5V ensures compatibility with standard logic levels, making integration with existing systems easier.

No. of Outputs: 8

With 8 outputs, this PLD can handle multiple signal paths simultaneously, increasing its usefulness in various applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2CJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

Propagation Delay:

35 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T20

Qualified:

No

Trade Compliance

PAL16L8A-2CJ Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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