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PAL16L8A-2MW

Texas Instruments

PAL16L8A-2MW by Texas Instruments

PAL16L8A-2MW by Texas Instruments is a TTL technology-based PLD with 40ns propagation delay. It features 16 inputs, 8 outputs, and 6 I/O lines in a ceramic package. Ideal for military applications due to its wide operating temperature range of -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,491 parts In-Stock

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Digiode

USA . 333 parts In-Stock

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333

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AZTECH Wire

Italy . 492 parts In-Stock

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$14.012

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492

$14.012

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One Stop Electronics

USA . 1,319 parts In-Stock

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$30.000

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Parana Technologies

USA . 2,028 parts In-Stock

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$51.365

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DigiPath Technology Company

USA . 318 parts In-Stock

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$56.559

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$52.034

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318

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$52.034

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IDEA Electronic Components Group

UK . 2,352 parts In-Stock

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$57.713

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$54.827

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$51.942

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2,352

$57.713

$54.827

$51.942

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ChromeModa Solutions

Germany . 243 parts In-Stock

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$57.713

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$47.325

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Corphita

USA . 2,329 parts In-Stock

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Overview

Elevate your projects with the PAL16L8A-2MW by Texas Instruments! Crafted with precision and expertise, this Programmable Logic Device offers unparalleled quality and reliability. Ideal for a wide range of applications, this PLD provides lightning-fast performance and seamless integration, ensuring optimal functionality for your designs. Trust in Texas Instruments' legacy of excellence and innovation to deliver outstanding value and benefits to your projects. Upgrade to the PAL16L8A-2MW today and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides superior quality and durability, making this product ideal for demanding industrial applications.

Propagation Delay: 40 ns

The low propagation delay of 40 ns ensures fast processing and response times, making this PLD suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this PLD can handle higher power requirements and voltages, making it versatile for various operating conditions.

Technology Used: TTL

The use of TTL technology ensures reliable performance and compatibility with other TTL components, enhancing overall system reliability and stability.

No. of Inputs: 16

Having 16 inputs provides ample connectivity options and flexibility for designing complex logic circuits and functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources and allows for easy integration into existing systems.

Output Function: COMBINATORIAL

The combinatorial output function allows for a wide range of logic operations and configurations, making this PLD versatile for different applications.

No. of Outputs: 8

Having 8 outputs provides flexibility in driving multiple external devices or components, expanding the functionality of the PLD.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 125°C allows this PLD to operate reliably in extreme environmental conditions.

Technical Specifications

Programmable Logic Devices (PLD) PAL16L8A-2MW attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Propagation Delay:

40 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

R-GDFP-F20

Qualified:

No

Trade Compliance

PAL16L8A-2MW Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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